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L9953LXP

STMicroelectronics

L9953LXP by STMicroelectronics

L9953LXP by STMicroelectronics is a consumer IC with a 36-terminal, dual gull-wing design. It operates b/w 7V and 28V, with a peak reflow temp of 260 °C for efficient soldering. Ideal for compact applications due to its small outline package (2.47mm height).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,879 parts In-Stock

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5,879

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Digiode

USA . 4,873 parts In-Stock

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4,873

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Anansix

USA . 2,035 parts In-Stock

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2,035

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 811 parts In-Stock

1+ parts

$2.205

100+ parts

-

1k+ parts

$1.985

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-

811

$2.205

-

$1.985

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MKK Technologies

India . 1,105 parts In-Stock

1+ parts

$4.147

100+ parts

-

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1,105

$4.147

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DigiPath Technology Company

USA . 1,105 parts In-Stock

1+ parts

$4.147

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1,105

$4.147

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AZTECH Wire

Italy . 1,116 parts In-Stock

1+ parts

$18.370

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1,116

$18.370

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Microchip USA

USA . 198 parts In-Stock

1+ parts

$22.136

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198

$22.136

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RC Electronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,602 parts In-Stock

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4,602

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A-Z Elektronik GmbH

Germany . 2,940 parts In-Stock

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2,940

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Alle Elektronik GmbH

Germany . 1,960 parts In-Stock

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1,960

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Parana Technologies

USA . 1,225 parts In-Stock

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$2.637

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1,225

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$2.637

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Unlock unparalleled performance and reliability with the L9953LXP from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatile consumer applications, this robust, compact IC ensures exceptional quality and efficiency, empowering your projects with seamless integration and superior functionality. Elevate your designs with the trusted expertise of STMicroelectronics, where cutting-edge technology meets outstanding customer value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package, protecting the IC from environmental factors while keeping production costs low.

Surface Mount: YES

Surface mount technology allows for compact layout designs and improved performance by minimizing signal traces, making it ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, allowing for versatile design applications in consumer electronics.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC delivers quality performance tailored for everyday electronic devices.

No. of Terminals: 36

The 36 terminals provide ample connectivity options, supporting complex functionalities in consumer devices without requiring additional components.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes footprint and enhances circuit density, making it suitable for compact electronic devices.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finish improves solderability and corrosion resistance, ensuring reliable electrical connections for long-term use.

Terminal Position: DUAL

Dual terminal position enhances ease of routing on the PCB, providing design flexibility for various applications.

Maximum Seated Height: 2.47 mm

A low maximum seated height allows for more compact designs, making this IC suitable for space-constrained applications.

Width: 7.5 mm

The 7.5 mm width allows easy integration into various circuit layouts without sacrificing performance.

Minimum Supply Voltage (Vsup): 7 V

The minimum supply voltage of 7 V offers flexibility in power supply design, compatible with a range of consumer applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds optimizes assembly processes, ensuring consistent quality during manufacturing.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures the IC can withstand the soldering process without damage, contributing to robust assembly.

Length: 10.3 mm

A length of 10.3 mm supports compact designs while providing sufficient area for terminal connection.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and offer good accessibility for rework and inspection.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density designs without sacrificing performance or manufacturability.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates routine handling and processing prior to assembly, making it user-friendly for manufacturers.

Maximum Supply Voltage (Vsup): 28 V

The capability to support a maximum supply voltage of 28 V makes this IC versatile for various power supply options in consumer applications.

Technical Specifications

Other Function Consumer ICs L9953LXP attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

L9953LXP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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