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L9842ND

STMicroelectronics

L9842ND by STMicroelectronics

STMicroelectronics L9842ND is a BCDMOS peripheral driver with 8-bit driver. It operates in automotive temperature grade (-40 to 125 °C) and supports power supplies of 5/25V. With a max output current of 0.35A, it comes in a small outline package for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,214 parts In-Stock

1+ parts

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2,214

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Vyrian

USA . 2,108 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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2,108

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Anansix

USA . 1,230 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,230

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,352 parts In-Stock

1+ parts

$2.857

100+ parts

-

1k+ parts

$2.571

10k+ parts

-

1,352

$2.857

-

$2.571

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MKK Technologies

India . 1,779 parts In-Stock

1+ parts

$5.372

100+ parts

-

1k+ parts

-

10k+ parts

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1,779

$5.372

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DigiPath Technology Company

USA . 1,779 parts In-Stock

1+ parts

$5.372

100+ parts

-

1k+ parts

-

10k+ parts

-

1,779

$5.372

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-

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Corphita

USA . 3,817 parts In-Stock

1+ parts

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3,817

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Parana Technologies

USA . 1,006 parts In-Stock

1+ parts

-

100+ parts

$3.416

1k+ parts

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10k+ parts

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1,006

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$3.416

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Overview

Elevate your automotive electronics with the STMicroelectronics L9842ND, a top-of-the-line peripheral driver that guarantees quality and reliability. Crafted by the renowned manufacturer, this driver offers unparalleled performance and precision in a compact package. With a wide range of applications, from vehicles to industrial machinery, the L9842ND delivers exceptional value and benefits to customers looking for seamless integration and efficient power management. Trust in STMicroelectronics to provide cutting-edge technology that exceeds expectations and drives innovation in the automotive industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

Power Supplies (V): 5/25

Support for multiple power supply voltages (5V and 25V) provides flexibility in different circuit designs.

No. of Terminals: 20

Having 20 terminals allows for connection to a variety of components and peripherals, enhancing compatibility.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in challenging environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range (-40 to 125 °C) makes it suitable for use in various conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring a secure connection.

Technology: BCDMOS

BCDMOS technology offers a good balance between power efficiency and speed, enhancing overall performance.

Driver No. of Bits: 8

Having 8 bits allows for precise control and handling of data, making it suitable for a wide range of applications.

Technical Specifications

Peripheral Drivers L9842ND attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

8

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.35 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/25

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

L9842ND Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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