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L9638D

STMicroelectronics

L9638D by STMicroelectronics

L9638D by STMicroelectronics is a line transceiver with a max supply voltage of 26V and operates within 6-26V. It features a max transmit delay of 4000 ns and an ISO 9141 interface, making it ideal for automotive communication applications. Its compact SO package ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,237 parts In-Stock

1+ parts

-

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4,237

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Vyrian

USA . 3,828 parts In-Stock

1+ parts

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3,828

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Anansix

USA . 940 parts In-Stock

1+ parts

-

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940

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 674 parts In-Stock

1+ parts

$2.660

100+ parts

-

1k+ parts

$2.394

10k+ parts

-

674

$2.660

-

$2.394

-

MKK Technologies

India . 103 parts In-Stock

1+ parts

$5.001

100+ parts

-

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103

$5.001

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DigiPath Technology Company

USA . 103 parts In-Stock

1+ parts

$5.001

100+ parts

-

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103

$5.001

-

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Microchip USA

USA . 473 parts In-Stock

1+ parts

$6.900

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-

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473

$6.900

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AZTECH Wire

Italy . 1,006 parts In-Stock

1+ parts

$15.550

100+ parts

-

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1,006

$15.550

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A-Z Elektronik GmbH

Germany . 5,844 parts In-Stock

1+ parts

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5,844

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Corphita

USA . 4,507 parts In-Stock

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4,507

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

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4,500

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Alle Elektronik GmbH

Germany . 3,896 parts In-Stock

1+ parts

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3,896

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

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100+ parts

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2,500

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Parana Technologies

USA . 2,103 parts In-Stock

1+ parts

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100+ parts

$3.180

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2,103

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$3.180

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Kepictronics

USA . 85 parts In-Stock

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85

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Overview

Unlock seamless communication with the L9638D from STMicroelectronics, a leader in innovative solutions. This cutting-edge line driver and receiver ensures reliable performance across diverse applications, from automotive systems to industrial controls. With its compact design and robust capabilities, you gain enhanced efficiency and durability, reducing downtime and maintenance costs. Experience superior quality built on decades of expertise, empowering your projects with unmatched reliability and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this product reliable in various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern PCB layouts.

Maximum Supply Voltage: 26 V

A high maximum supply voltage gives flexibility in different system designs and power requirements.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for space-saving designs and enhances layout options.

Maximum Transmit Delay: 4000 ns

A maximum transmit delay of 4000 ns allows for reliable data transmission without significant lag.

No. of Terminals: 8

With 8 terminals, the device provides multiple connection options, contributing to its versatility in applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in minimizing PCB space, ideal for compact electronic devices.

Minimum Supply Voltage: 6 V

A low minimum supply voltage provides compatibility with a variety of power sources, increasing usability.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent conductivity and resistance to corrosion, enhancing reliability.

Terminal Position: DUAL

Dual terminal position promotes easier routing on PCBs, allowing for increased design flexibility.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a compact device profile, fitting easily into dense circuit layouts.

Width: 3.9 mm

A narrow width supports space-efficient designs, making it suitable for applications with limited real estate.

Length: 4.9 mm

Short overall length facilitates easier integration onto various platforms without requiring significant layout changes.

Maximum Receive Delay: 6000 ns

With a maximum receive delay of 6000 ns, it ensures timely data reception, enhancing overall system performance.

Terminal Form: GULL WING

The gull wing terminal form promotes easier soldering and enhances mechanical stability, improving the connection integrity.

Interface Standard: ISO 9141

Complying with ISO 9141 ensures compatibility with automotive applications, making it ideal for automotive diagnostic tools.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics provide improved noise immunity, ensuring reliable signal processing.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage of 13.5 V enables optimal performance in automotive and industrial applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard for many PCB layouts, making it easy to fit into existing designs.

Interface IC Type: LINE TRANSCEIVER

The line transceiver IC type is essential for high-speed communication, making this product suitable for robust data transmission applications.

Technical Specifications

Line Drivers & Receivers L9638D attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

ISO 9141

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Receive Delay:

6000 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

4000 ns

Width:

3.9 mm

Trade Compliance

L9638D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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