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L9386MD-TR

STMicroelectronics

L9386MD-TR by STMicroelectronics

L9386MD-TR by STMicroelectronics is a dual-function peripheral driver with a max supply voltage of 32V and built-in protections against overcurrent and thermal issues. It features a compact SO package (12.8mm x 7.5mm) for efficient surface mounting. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,714 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,714

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Digiode

USA . 4,396 parts In-Stock

1+ parts

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4,396

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Anansix

USA . 2,454 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,454

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 353 parts In-Stock

1+ parts

$2.120

100+ parts

-

1k+ parts

$1.908

10k+ parts

-

353

$2.120

-

$1.908

-

MKK Technologies

India . 627 parts In-Stock

1+ parts

$3.986

100+ parts

-

1k+ parts

-

10k+ parts

-

627

$3.986

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-

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DigiPath Technology Company

USA . 627 parts In-Stock

1+ parts

$3.986

100+ parts

-

1k+ parts

-

10k+ parts

-

627

$3.986

-

-

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Microchip USA

USA . 227 parts In-Stock

1+ parts

$4.101

100+ parts

-

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227

$4.101

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AZTECH Wire

Italy . 273 parts In-Stock

1+ parts

$16.950

100+ parts

-

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273

$16.950

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-

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Component Stockers USA

USA . 566 parts In-Stock

1+ parts

$99.990

100+ parts

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566

$99.990

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Corphita

USA . 4,630 parts In-Stock

1+ parts

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4,630

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Vigor

Singapore . 2,435 parts In-Stock

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2,435

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Parana Technologies

USA . 373 parts In-Stock

1+ parts

-

100+ parts

$2.534

1k+ parts

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373

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$2.534

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Overview

Unlock exceptional performance with the L9386MD-TR from STMicroelectronics, a leader in innovative technology. Designed for reliability and efficiency, this peripheral driver enhances your applications across automotive and industrial sectors. With built-in protections against transient spikes and overloads, it ensures longevity and safety. Elevate your projects with seamless integration and robust functionality, empowering you to create smarter, more resilient systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy ensures that the product is robust and can withstand environmental stresses, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into modern circuit boards, facilitating improved manufacturing processes and compact designs.

Maximum Supply Voltage: 32 V

A high maximum supply voltage provides versatility, allowing the component to work in different systems without risk of failure under voltage stress.

No. of Functions: 2

Having multiple functions in a single device enhances efficiency and allows for more compact circuit designs, saving space and reducing component count.

Package Shape: RECTANGULAR

The rectangular shape is a common and space-efficient design, optimizing board layout and connectivity options.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Integrated protections enhance reliability by safeguarding the device from common electrical faults, ensuring long-term performance and reduced maintenance costs.

Power Supplies (V): 12

With a standard operating voltage, it is ideal for a wide range of applications, ensuring compatibility with common electronic systems.

No. of Terminals: 20

A sufficient number of terminals enables multiple connections, allowing for more complex circuit integrations and signal routing.

Package Style (Meter): SMALL OUTLINE

The small outline package style is suited for compact design needs, ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage increases compatibility with a wider range of devices, enhancing the product's versatility and usability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish provides excellent conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options on circuit boards, aiding in efficient design and assembly.

Maximum Seated Height: 2.65 mm

A low seated height contributes to a compact design and a reduced overall profile, suitable for miniaturized electronic applications.

Width: 7.5 mm

The specific width dimension fits well in standard layout designs, ensuring compatibility with existing circuit board configurations.

Maximum Time At Peak Reflow Temperature (s): 30

A reasonable reflow temperature duration allows for better soldering practices, reducing the risk of damage to components during assembly.

Peak Reflow Temperature °C: 260

A high peak reflow temperature is suitable for robust soldering processes, allowing compatibility with a variety of manufacturing techniques.

Length: 12.8 mm

The dimensioned length fits well into various PCB configurations, allowing efficient layout and integration into designs.

Technology: BCD

BCD technology optimizes performance for peripheral driver applications, providing effective driving capabilities with low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve reliability in mechanical support, making assembly straightforward and effective.

Nominal Supply Voltage: 12 V

Operating at a nominal 12 V is common in many applications, enhancing versatility and easing integration with existing systems.

Turn-on Time: 25 us

Fast turn-on time allows for efficient switching operations, improving overall system response times.

Terminal Pitch: 1.27 mm

With a standard terminal pitch, this product is compatible with most PCB designs, simplifying integration and assembly.

Driver No. of Bits: 2

A two-bit driver configuration maintains flexibility in handling multiple control signals while staying efficient.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate sensitivity to moisture, guiding manufacturers during storage and handling to ensure product effectiveness.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based design is widely applicable, providing essential driving capabilities for a range of peripheral devices.

Turn-off Time: 30 us

Quick turn-off time enhances system efficiency and performance, allowing for rapid repetition of control signals.

Output Current Flow Direction: SINK

A sink output flow direction is effective for controlling loads in a variety of applications, adding to the device's versatility.

Technical Specifications

Peripheral Drivers L9386MD-TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

20

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BCD

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

30 us

Turn-on Time:

25 us

Width:

7.5 mm

Trade Compliance

L9386MD-TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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