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L6585D

STMicroelectronics

L6585D by STMicroelectronics

L6585D by STMicroelectronics is a versatile switching regulator designed for automotive applications, operating b/w -40 °C and 125°C. It features a nominal voltage of 15V, max output current of 0.6A, and operates at a max frequency of 250kHz. Ideal for power factor correction and fluorescent light control, it ensures efficient performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,426 parts In-Stock

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5,426

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Digiode

USA . 3,852 parts In-Stock

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3,852

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Anansix

USA . 1,899 parts In-Stock

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1,899

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ComSIT Distribution GmbH

Germany . 840 parts In-Stock

1+ parts

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840

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Cyclops Electronics Ltd

UK . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 357 parts In-Stock

1+ parts

$6.574

100+ parts

-

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357

$6.574

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IDEA Electronic Components Group

UK . 1,607 parts In-Stock

1+ parts

$8.243

100+ parts

-

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$7.419

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1,607

$8.243

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$7.419

-

MKK Technologies

India . 1,996 parts In-Stock

1+ parts

$15.501

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1,996

$15.501

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DigiPath Technology Company

USA . 1,996 parts In-Stock

1+ parts

$15.501

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-

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1,996

$15.501

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AZTECH Wire

Italy . 842 parts In-Stock

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$18.280

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842

$18.280

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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30,000

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Kepictronics

USA . 10,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,459 parts In-Stock

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5,459

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Alle Elektronik GmbH

Germany . 3,639 parts In-Stock

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3,639

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Vigor

Singapore . 1,242 parts In-Stock

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Corphita

USA . 1,116 parts In-Stock

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1,116

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Parana Technologies

USA . 107 parts In-Stock

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$9.856

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107

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$9.856

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Overview

Elevate your designs with the L6585D from STMicroelectronics, a trusted leader in semiconductor innovation. This robust switching regulator offers exceptional performance across various applications, ensuring efficient power management for automotive and consumer electronics. With a wide operating temperature range and advanced control technology, it delivers reliability and precision. Experience superior quality and value that empower your projects to thrive in demanding environments!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental stresses, making it suitable for a variety of applications.

Surface Mount: YES

Being a surface mount device allows for easier integration into compact PCB designs, saving board space and improving manufacturability.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on the PCB and facilitates improved thermal dissipation.

Nominal Supply Voltage (Vsup): 15 V

A nominal supply voltage of 15V provides a reliable voltage level for many common applications, ensuring compatibility with various power systems.

Power Supplies (V): 15

Supports power supply configurations that are standard in many designs, simplifying system integration.

No. of Terminals: 20

With 20 terminals, the device offers sufficient connectivity for multiple functionalities, allowing for more complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces space requirements on the PCB, allowing for more compact device designs.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability and longevity in demanding environments, making it suitable for automotive applications.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides stable operation and is effective for precise voltage regulation in power supply systems.

Minimum Operating Temperature: -40 °C

A wide operational temperature range enhances versatility and reliability in applications subjected to extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish ensures excellent conductivity and resistance to corrosion, enhancing the reliability of solder joints and connections.

Terminal Position: DUAL

Dual terminal positioning optimizes layout flexibility on PCBs, accommodating different design preferences.

Maximum Seated Height: 2.65 mm

The low seated height facilitates compact designs and is ideal for applications where space is a constraint.

Width: 7.5 mm

A narrow width allows for dense component placement on circuitry, improving overall design compactness.

Other IC Type: POWER FACTOR AND FLUORESCENT LIGHT CONTROLLER

Its capability to control power factor and fluorescent lighting applications makes it versatile for energy-efficient designs.

Nominal Input Voltage: 15 V

The nominal input voltage aligns with common power supply standards, facilitating integration in existing systems.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes, maintaining assembly efficiency.

Peak Reflow Temperature (°C): 260

A peak reflow temperature of 260 °C allows for compatibility with high-temperature soldering processes, ensuring robust connections.

Length: 12.8 mm

The compact length contributes to space-saving designs while still providing sufficient terminal access for connections.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, the device is engineered to operate reliably under harsh conditions typically found in vehicles.

Maximum Switching Frequency: 250 kHz

A high switching frequency enhances performance, allows for smaller passive components, and improves overall power conversion efficiency.

Maximum Output Current: 0.6 A

With a maximum output current of 0.6 A, it can handle substantial loads while maintaining efficiency and performance.

Technology: BCDMOS

BCD technology integrates digital and analog functionalities, enhancing design flexibility and reducing component count.

Terminal Form: GULL WING

The gull wing terminal form is ideal for automated assembly processes and provides reliable soldered connections.

Control Technique: PULSE WIDTH MODULATION

Pulse Width Modulation control technique allows for efficient power management and precise output regulation.

Switcher Config: PUSH-PULL

The push-pull configuration improves efficiency and reduces electromagnetic interference (EMI), leading to cleaner signal integrity.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy integration with various PCB designs and automated assembly processes.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, making it suitable for controlled environments during manufacturing and storage.

Minimum Input Voltage: 11 V

A minimum input voltage of 11V ensures reliable operation in various power supply configurations while offering design flexibility.

Maximum Input Voltage: 16 V

The maximum input voltage of 16V allows headroom for voltage fluctuations in diverse applications, ensuring stable operation.

Technical Specifications

Switching Regulators & Controllers L6585D attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Additional Features:

IT CAN ALSO OPERATE WITH CURRENT MODE

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

16 V

Minimum Input Voltage:

11 V

Nominal Input Voltage:

15 V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Switching Regulator or Controllers

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

250 kHz

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

L6585D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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