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L6219R013TR

STMicroelectronics

L6219R013TR by STMicroelectronics

L6219R013TR by STMicroelectronics is a bipolar stepper motor controller designed for motion control applications. It operates at a nominal voltage of 5V, supports up to 1A output current, and features a compact 24-terminal SO package. With an operating temp range of -20 °C to 85 °C, it's ideal for various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,772 parts In-Stock

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4,772

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Vyrian

USA . 3,487 parts In-Stock

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3,487

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Anansix

USA . 677 parts In-Stock

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677

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Distributors (Availability)

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Microchip USA

USA . 280 parts In-Stock

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$6.940

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280

$6.940

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IDEA Electronic Components Group

UK . 2,062 parts In-Stock

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$7.346

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-

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$6.612

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2,062

$7.346

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$6.612

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AZTECH Wire

Italy . 885 parts In-Stock

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$12.590

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885

$12.590

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MKK Technologies

India . 1,725 parts In-Stock

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$13.814

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1,725

$13.814

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DigiPath Technology Company

USA . 1,725 parts In-Stock

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$13.814

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1,725

$13.814

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Vigor

Singapore . 3,849 parts In-Stock

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Corphita

USA . 3,764 parts In-Stock

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3,764

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Parana Technologies

USA . 1,922 parts In-Stock

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$8.784

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1,922

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$8.784

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Perfect Parts

USA . 787 parts In-Stock

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Overview

Elevate your motion control projects with the L6219R013TR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality stepper motor controller excels in precision and efficiency, ensuring reliable performance across diverse applications—from robotics to automation systems. With its compact design and robust temperature range, it delivers exceptional value, empowering your designs to achieve greater productivity and reliability. Choose STMicroelectronics for unmatched quality and transformative technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials makes the package lightweight and cost-effective, while ensuring adequate protection for the internal components.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs, better performance, and increased manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB and enhances the layout flexibility for designers.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is widely used, making it compatible with many designs and reducing the need for complex voltage regulation.

Power Supplies (V): 4.5, 5

The availability of multiple power supply options (4.5V to 5V) allows for greater versatility in application settings.

No. of Terminals: 24

With 24 terminals, this IC supports numerous connectivity options, facilitating complex applications and configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, promoting efficient use of PCB real estate.

Maximum Operating Temperature: 85 °C

An operational temperature limit of 85 °C ensures reliability in various environmental conditions, making it ideal for industrial applications.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20 °C, the IC performs effectively in cold environments, expanding its application range.

Terminal Position: DUAL

Dual terminal positioning improves the mounting stability and layout flexibility on the circuit board.

Maximum Seated Height: 2.65 mm

A maximum height of just 2.65 mm is advantageous for low-profile designs, ensuring compatibility with modern compact devices.

Width: 7.5 mm

The width of 7.5 mm is suitable for achieving high-density layouts without compromising signal integrity.

Other IC type: STEPPER MOTOR CONTROLLER

As a stepper motor controller, it provides precise control for motion applications, making it perfect for robotics and various automation tasks.

Minimum Supply Voltage (Vsup): 4.75 V

The minimum supply voltage of 4.75V provides flexibility in operating conditions and ensures stable performance.

Length: 15.4 mm

A length of 15.4 mm allows for effective placement and integration into circuit designs without excessive space requirements.

Maximum Output Current: 1 A

A maximum output current of 1 A is adequate for driving various loads, making it suitable for diverse applications.

Technology: BIPOLAR

Bipolar technology ensures fast switching and efficient performance, catering to high-speed operational requirements.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and better mechanical connection on the PCB, enhancing reliability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard in surface mount technology, aiding in compatibility with existing assembly processes.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage of 5.25 V provides a buffer for voltage fluctuations, ensuring consistent performance under varying conditions.

Technical Specifications

Motion Control ICs L6219R013TR attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Additional Features:

CONTROL FOR TWO DC MOTORS; ALSO REQUIRES A 4.5 VOLTS TO 10 VOLTS SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

4.5,5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.5 mm

Trade Compliance

L6219R013TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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