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L5989DTR

STMicroelectronics

L5989DTR by STMicroelectronics

L5989DTR by STMicroelectronics is a compact switching regulator designed for automotive applications, featuring a max output current of 5.06 A and a voltage-mode control technique. It operates within -40 °C to 125°C and supports input voltages from 2.9 V to 18 V. Its small outline package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Digiode

USA . 4,726 parts In-Stock

1+ parts

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4,726

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Anansix

USA . 429 parts In-Stock

1+ parts

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429

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ComSIT Distribution GmbH

Germany . 6 parts In-Stock

1+ parts

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 548 parts In-Stock

1+ parts

$10.890

100+ parts

-

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548

$10.890

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Microchip USA

USA . 325 parts In-Stock

1+ parts

$17.084

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325

$17.084

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IDEA Electronic Components Group

UK . 1,547 parts In-Stock

1+ parts

$18.245

100+ parts

-

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$16.421

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1,547

$18.245

-

$16.421

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Advanced Electronics

New Zealand . 25 parts In-Stock

1+ parts

$25.476

100+ parts

$23.183

1k+ parts

$20.890

10k+ parts

-

25

$25.476

$23.183

$20.890

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MKK Technologies

India . 2,335 parts In-Stock

1+ parts

$34.309

100+ parts

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2,335

$34.309

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DigiPath Technology Company

USA . 2,335 parts In-Stock

1+ parts

$34.309

100+ parts

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2,335

$34.309

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Component Stockers USA

USA . 621 parts In-Stock

1+ parts

$99.990

100+ parts

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621

$99.990

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Corphita

USA . 2,857 parts In-Stock

1+ parts

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2,857

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Parana Technologies

USA . 2,266 parts In-Stock

1+ parts

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$21.815

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2,266

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$21.815

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Perfect Parts

USA . 2 parts In-Stock

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2

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Overview

Elevate your designs with the L5989DTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance switching regulator boasts exceptional thermal efficiency and reliability, ideal for automotive applications and beyond. Its compact size and robust construction ensure seamless integration into diverse systems. Choose the L5989DTR to experience enhanced performance, lower power consumption, and the trusted quality that only STMicroelectronics can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount design allows for compact PCB layouts and facilitates automated assembly processes, enhancing manufacturing efficiency.

Package Shape: RECTANGULAR

A rectangular package shape provides optimal space utilization on printed circuit boards, ideal for space-constrained applications.

No. of Terminals: 16

Having 16 terminals allows for complex functions and multiple connections, ensuring versatility in design and usage.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The thin profile and heat sink/slug design assists in better thermal management, enhancing performance under high loads.

Maximum Operating Temperature: 125 °C

With a high operating temperature limit, this product is suitable for harsh environments and automotive applications.

Control Mode: VOLTAGE-MODE

Voltage-mode control allows for improved transient response and stability, making it ideal for precise output voltage applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes it suitable for extreme conditions, ensuring reliability in automotive and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances solderability and provides excellent electrical conductivity, ensuring robust connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layouts and better integration within designs.

Maximum Seated Height: 1.2 mm

A low seated height enables efficient space-saving on PCBs, ideal for compact device designs.

Width: 4.4 mm

A narrow width allows for high-density layouts, making it perfect for miniaturized applications.

Other IC type: SWITCHING REGULATOR

As a switching regulator, it provides efficient power conversion, minimizing energy loss and maximizing performance.

Nominal Input Voltage: 12 V

Nominal 12V input makes it compatible with standard automotive and electronic power systems.

Maximum Time At Peak Reflow Temperature (s): 40

A peak reflow time of 40 seconds ensures reliability during soldering processes, reducing the risk of component damage.

Peak Reflow Temperature °C: 260

The high temperature tolerance during reflow soldering allows for compatibility with a wide range of manufacturing processes.

Length: 5 mm

A compact length of 5 mm facilitates space-efficient designs and helps engineers optimize board space.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, ensuring reliability and durability in vehicle applications.

Maximum Switching Frequency: 1000 kHz

A high switching frequency allows for smaller passive components, improving efficiency and reducing overall system size.

Maximum Output Current: 5.06 A

The ability to deliver a maximum output current of 5.06 A makes it suitable for demanding applications that require reliable power delivery.

Technology: BCDMOS

BCD technology combines the benefits of digital and analog processing in one chip, enhancing performance and area efficiency.

Terminal Form: GULL WING

Gull wing terminals ensure good mechanical and solder connection, promoting long-term reliability and performance.

Control Technique: PULSE WIDTH MODULATION

Using pulse width modulation provides efficient control of output voltage, improving overall power management and effectiveness.

Switcher Config: BUCK

The buck configuration allows for efficient step-down voltage conversion, maximizing energy efficiency in power management applications.

Terminal Pitch: 0.65 mm

A small terminal pitch enables high-density placement on PCBs, supporting miniaturized product design.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate humidity sensitivity, suitable for typical manufacturing conditions with proper storage.

Minimum Input Voltage: 2.9 V

The low minimum input voltage expands its usability across various applications, including battery-operated devices.

Maximum Input Voltage: 18 V

With a maximum input of 18V, this regulator is versatile and can handle a wide range of input power sources.

Technical Specifications

Switching Regulators & Controllers L5989DTR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 18V

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

18 V

Minimum Input Voltage:

2.9 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5.06 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1000 kHz

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4.4 mm

Trade Compliance

L5989DTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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