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L5973DD

STMicroelectronics

L5973DD by STMicroelectronics

L5973DD by STMicroelectronics is a low-profile buck switching regulator designed for automotive applications. It supports a nominal input voltage of 12V, delivers up to 3.5A output current, and operates b/w -40 °C to 125 °C. Its compact design features an 8-terminal gull-wing package for efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,974 parts In-Stock

1+ parts

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3,974

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Vyrian

USA . 3,456 parts In-Stock

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3,456

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Anansix

USA . 2,723 parts In-Stock

1+ parts

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2,723

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 70 parts In-Stock

1+ parts

$15.154

100+ parts

-

1k+ parts

$13.639

10k+ parts

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70

$15.154

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$13.639

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MKK Technologies

India . 551 parts In-Stock

1+ parts

$28.497

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551

$28.497

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DigiPath Technology Company

USA . 551 parts In-Stock

1+ parts

$28.497

100+ parts

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551

$28.497

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Corphita

USA . 1,130 parts In-Stock

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1,130

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Parana Technologies

USA . 614 parts In-Stock

1+ parts

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$18.119

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614

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$18.119

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Overview

Unlock unparalleled efficiency with the L5973DD from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for automotive applications, this robust switching regulator delivers exceptional performance even in extreme conditions, ensuring reliability and longevity. With its compact footprint and high output capability, it’s perfect for powering your devices while saving space and energy. Choose the L5973DD to elevate your designs with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides good thermal and physical protection, ensuring reliability in various environmental conditions.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of board space, making it ideal for modern electronic applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on printed circuit boards, facilitating easier integration into complex layouts.

No. of Terminals: 8

The 8 terminals support versatile connections, enabling multiple functionality options in a compact footprint.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

This low-profile package style enhances heat dissipation and fits well into tight spaces within electronic devices.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating allows for operation in demanding environments, adding to its reliability in automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance in extreme cold conditions, making it suitable for diverse applications.

Terminal Position: DUAL

Dual terminal positioning facilitates easier PCB layout and optimized routing, enhancing overall design efficiency.

Maximum Seated Height: 1.7 mm

A low seated height contributes to a compact design profile, which is critical for space-constrained applications.

Width: 3.9 mm

The narrow width allows for high-density designs, enabling integration in small electronic devices.

Other IC Type: SWITCHING REGULATOR

Being a switching regulator means it provides efficient voltage regulation, reducing energy loss compared to linear regulators.

Nominal Input Voltage: 12 V

Designed for a nominal 12 V input, this product is ideal for standard automotive and industrial applications.

Maximum Time At Peak Reflow Temperature: 40 s

This specification indicates the IC can withstand the soldering process without damage, ensuring durability.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C ensures compatibility with modern assembly processes, maintaining solder joint integrity.

Length: 4.9 mm

A short length helps maintain a compact layout, which is important for reducing the overall size of electronic assemblies.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, this part ensures enhanced reliability and performance in automotive applications.

Maximum Switching Frequency: 280 kHz

High switching frequency enables efficient regulation and lower component count, which can lead to cost savings and reduced size.

Maximum Output Current: 3.5 A

With a maximum output current of 3.5 A, it can power a wide range of connectors and peripherals.

Terminal Form: GULL WING

The gull wing terminal form eases soldering and improves mechanical stress handling, leading to increased reliability.

Switcher Config: BUCK

As a buck converter, it is highly efficient for stepping down voltage, making it a preferred choice for many power supply designs.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is a standard, allowing for easy integration onto prototype and production boards.

Minimum Input Voltage: 4 V

A low minimum input voltage enhances versatility, allowing operation across a wider range of supply voltages.

Maximum Input Voltage: 36 V

The high maximum input voltage makes it suitable for various applications, including those with fluctuating power supply conditions.

Technical Specifications

Switching Regulators & Controllers L5973DD attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Maximum Input Voltage:

36 V

Minimum Input Voltage:

4 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

280 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

L5973DD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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