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L4988MD

STMicroelectronics

L4988MD by STMicroelectronics

L4988MD by STMicroelectronics is a fixed positive single output LDO regulator with a nominal output voltage of 5V and a max load current of 0.2A. It operates in temperatures from -40 °C to 150 °C, ensuring reliability in various applications. With low dropout voltage (0.27V) and excellent line regulation (0.025%), it's ideal for power-sensitive devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,939 parts In-Stock

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8,939

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Anansix

USA . 2,342 parts In-Stock

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2,342

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Digiode

USA . 693 parts In-Stock

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693

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 908 parts In-Stock

1+ parts

$5.258

100+ parts

-

1k+ parts

$4.732

10k+ parts

-

908

$5.258

-

$4.732

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AZTECH Wire

Italy . 472 parts In-Stock

1+ parts

$8.230

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-

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472

$8.230

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MKK Technologies

India . 969 parts In-Stock

1+ parts

$9.887

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-

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969

$9.887

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DigiPath Technology Company

USA . 969 parts In-Stock

1+ parts

$9.887

100+ parts

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969

$9.887

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Component Stockers USA

USA . 686 parts In-Stock

1+ parts

$99.990

100+ parts

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686

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 28,267 parts In-Stock

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28,267

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Vigor

Singapore . 10,000 parts In-Stock

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10,000

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Microchip USA

USA . 5,662 parts In-Stock

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5,662

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Corphita

USA . 2,808 parts In-Stock

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2,808

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Parana Technologies

USA . 1,060 parts In-Stock

1+ parts

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100+ parts

$6.286

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1,060

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$6.286

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Overview

Experience unparalleled reliability with the L4988MD from STMicroelectronics, a leader in innovative semiconductor solutions. This fixed positive output LDO regulator delivers exceptional performance in a compact design, perfect for diverse applications ranging from consumer electronics to automotive systems. With its robust operating temperature range and minimal voltage dropout, it ensures your devices run smoothly and efficiently, providing long-lasting value and superior quality you can trust. Upgrade your projects with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making this LDO suitable for various applications.

Maximum Dropout Voltage: 1.5 V

A low maximum dropout voltage allows for efficient operation, decreasing power loss and maximizing performance.

Surface Mount: YES

Surface mount technology enables compact designs and efficient manufacturing processes, ideal for modern electronic devices.

Operating Temperature (TJ-Max): 150 °C

The high maximum operating temperature increases reliability in harsh conditions and extends the lifespan of the device.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS features, resulting in lower power consumption and higher performance.

Package Shape: RECTANGULAR

A rectangular shape optimizes PCB layout and can support denser circuit configurations.

Terminal Form: GULL WING

Gull wing terminals provide easier soldering and stronger mechanical connections, enhancing reliability.

Operating Temperature (TJ-Min): -40 °C

A wide operating temperature range (-40 °C to 150 °C) ensures functionality in diverse environments.

Packing Method: TUBE

Tube packing is beneficial for automated placement and protects components during storage and transportation.

Minimum Output Voltage: 4.9 V

A minimum output voltage close to the nominal ensures stable supply under varying load conditions.

Maximum Voltage Tolerance: 2 %

The product's tight voltage tolerance guarantees consistent performance and reliability across different applications.

Nominal Output Voltage: 5 V

At a nominal output voltage of 5 V, this LDO is suitable for a wide range of consumer electronics and embedded systems.

No. of Terminals: 20

With 20 terminals, this LDO supports multiple features and functionalities while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs, making it perfect for compact electronic devices.

Adjustability: FIXED

A fixed output simplifies design considerations and provides a stable voltage source.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for closer placement on the PCB, enhancing design flexibility.

Maximum Line Regulation: 0.025 %

Exceptional line regulation ensures that output voltage remains stable despite variations in input voltage.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

This type ensures straightforward integration into designs requiring a stable and reliable power supply.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The quality terminal finish enhances solderability and corrosion resistance, improving overall durability.

Terminal Position: DUAL

Dual terminal positions can facilitate easier routing on the PCB and enhance layout versatility.

Maximum Output Voltage: 5.1 V

A slightly higher maximum output voltage enhances adaptability for various connected components.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, making proper handling during assembly essential.

Maximum Seated Height: 2.65 mm

A low seated height aids in maintaining a low profile for designs where vertical space is limited.

Width: 7.5 mm

This width provides a balance between component size and performance, ensuring that it fits into standard PCB layouts.

Maximum Load Regulation: 0.025 %

Outstanding load regulation improves performance under different load conditions, ensuring voltage stability.

Minimum Input Voltage: 5.6 V

The minimum input voltage ensures compatibility with various power sources while providing sufficient headroom for operation.

Maximum Output Current: 0.2 A

A maximum output current of 0.2 A is suitable for a range of low to moderate power applications.

Maximum Time At Peak Reflow Temperature: 30 seconds

This specification indicates the component's tolerance to thermal stress during the soldering process, enhancing reliability.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature allows for compatibility with various soldering processes, ensuring robust assembly.

Nominal Dropout Voltage: 0.27 V

A nominal dropout voltage of 0.27 V enhances efficiency, allowing for lower input voltages without compromising output.

Length: 12.8 mm

A modest length helps it fit into standard PCB layouts without requiring excessive space.

Maximum Input Voltage: 31 V

A high maximum input voltage allows for wider range voltage sources, adding versatility for different applications.

Maximum Input Voltage Absolute: 40 V

An absolute maximum input voltage of 40 V provides a safety margin against transient voltages, improving reliability.

Technical Specifications

Fixed Regulators - Positive Single Output LDO L4988MD attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.5 V

Nominal Dropout Voltage-1:

.27 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

31 V

Minimum Input Voltage:

5.6 V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Maximum Line Regulation:

.025 %

Maximum Load Regulation:

.025 %

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

20

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Maximum Output Voltage-1:

5.1 V

Minimum Output Voltage-1:

4.9 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

7.5 mm

Trade Compliance

L4988MD Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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