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L4969013TR

STMicroelectronics

L4969013TR by STMicroelectronics

L4969013TR by STMicroelectronics is an automotive-grade IC designed for networking applications. It operates with a supply voltage of 6V to 28V and features a surface mount PowerSO-20 package. This device comes in tape & reel packaging, ideal for efficient assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,953 parts In-Stock

1+ parts

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4,953

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Vyrian

USA . 3,765 parts In-Stock

1+ parts

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3,765

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Anansix

USA . 2,857 parts In-Stock

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2,857

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 386 parts In-Stock

1+ parts

$7.492

100+ parts

-

1k+ parts

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10k+ parts

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386

$7.492

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AZTECH Wire

Italy . 611 parts In-Stock

1+ parts

$21.670

100+ parts

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611

$21.670

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Vigor

Singapore . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 2,691 parts In-Stock

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2,691

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MKK Technologies

India . 1,316 parts In-Stock

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1,316

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DigiPath Technology Company

USA . 1,316 parts In-Stock

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1,316

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Parana Technologies

USA . 1,053 parts In-Stock

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1,053

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IDEA Electronic Components Group

UK . 401 parts In-Stock

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401

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Overview

Elevate your designs with the L4969013TR from STMicroelectronics, a trusted leader in innovative technology. This high-performance integrated circuit is perfect for networking applications, delivering exceptional reliability and efficiency across automotive projects. With its robust packaging and versatile voltage range, this component ensures seamless integration and long-lasting performance. Choose STMicroelectronics for quality you can count on—empower your creations today!

Feature Benefit Bullets

Other Names: 497-3356, 497-3356-1-NDR, 497-3356-ND, 497-3356-2-NDR, 497-3356-2, 497-3356-1

The variety of part numbers ensures compatibility with a wide array of applications and simplifies inventory management.

Standard Package: 600

A standard package of 600 makes it ideal for bulk purchasing and efficient supply chain management.

Category: Integrated Circuits (ICs) - Interface Specialized

As a specialized interface IC, it is designed to meet the specific needs of networking applications, making it a reliable choice for tech-savvy projects.

Packaging: Tape & Reel (TR) / Cut Tape (CT)

The packaging options enhance convenience for automated assembly processes and manual prototyping, offering flexibility in production.

Applications: Networking

Tailored for networking applications, this product ensures high-performance communication, making it suitable for modern data infrastructure.

Interface: Serial

A serial interface allows for efficient, point-to-point data transmission, which is essential in many electronic applications.

Voltage - Supply: 6V ~ 28V

A broad voltage supply range accommodates various system designs, providing versatility and adaptability in different circuits.

Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

The compact SOIC package with an exposed pad ensures better thermal performance and efficient space utilization on PCBs.

Supplier Device Package: PowerSO-20

The PowerSO-20 package is designed for high power applications, ensuring reliability and performance in demanding environments.

Grade: Automotive

An automotive grade designation means it meets stringent reliability standards, making it suitable for automotive applications.

Mounting Type: Surface Mount

Surface mount technology enables efficient use of space on the PCB and facilitates automated assembly lines.

Base Product Number: L4969

The base product number provides a reference point for compatibility with other components in the L4969 family.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

An MSL of 1 indicates that the device can be handled and mounted without strict moisture precautions, simplifying the production process.

Technical Specifications

Additional Parts L4969013TR attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Other Names:

497-3356
497-3356-1-NDR
497-3356-ND
497-3356-2-NDR
497-3356-2
497-3356-1

Category:

Integrated Circuits (ICs)
Interface Specialized

Applications:

Networking

Grade:

Automotive

Mounting Type:

Surface Mount

Supplier Device Package:

PowerSO-20

Standard Package:

600

Package / Case:

20-SOIC (0.433", 11.00mm Width) Exposed Pad

Voltage - Supply:

6V ~ 28V

Packaging:

Tape & Reel (TR)
Cut Tape (CT)

Interface:

Serial

Base Product Number:

L4969

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

L4969013TR Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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