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HCF4541M013TR

STMicroelectronics

HCF4541M013TR by STMicroelectronics

HCF4541M013TR by STMicroelectronics is a 16-bit synchronous digital counter with a max supply voltage of 20V and operates at temperatures from -55 °C to 125°C. It features positive edge triggering and load input capabilities. Ideal for military applications, it comes in a compact SO package.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,656 parts In-Stock

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Chip Stock

USA . 6,800 parts In-Stock

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6,800

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Anansix

USA . 1,344 parts In-Stock

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1,344

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ComSIT Distribution GmbH

Germany . 392 parts In-Stock

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392

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J2 Sourcing AB

Sweden . 372 parts In-Stock

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372

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Digiode

USA . 192 parts In-Stock

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192

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LWI Electronics Inc

India . 178 parts In-Stock

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178

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Distributors (Availability)

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Microchip USA

USA . 338 parts In-Stock

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$2.616

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338

$2.616

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IDEA Electronic Components Group

UK . 1,000 parts In-Stock

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$16.694

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$15.025

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1,000

$16.694

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$15.025

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AZTECH Wire

Italy . 902 parts In-Stock

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$18.680

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902

$18.680

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MKK Technologies

India . 2,195 parts In-Stock

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$31.393

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2,195

$31.393

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DigiPath Technology Company

USA . 2,195 parts In-Stock

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$31.393

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2,195

$31.393

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Component Stockers USA

USA . 411 parts In-Stock

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$99.990

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411

$99.990

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Kepictronics

USA . 48,500 parts In-Stock

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Perfect Parts

USA . 15,798 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Corphita

USA . 3,561 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,647 parts In-Stock

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Northwest PG Solutions

USA . 1,417 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,098 parts In-Stock

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Parana Technologies

USA . 773 parts In-Stock

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$19.961

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773

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$19.961

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Native Components

USA . 623 parts In-Stock

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623

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Overview

Unlock precision and reliability with the HCF4541M013TR from STMicroelectronics, a leader in innovative semiconductor solutions. This 16-bit digital counter excels in demanding applications, delivering superior performance with its robust design. Engineered for optimal efficiency and longevity, it thrives in harsh environments, making it ideal for military, automotive, and industrial uses. Elevate your projects with a trusted partner that prioritizes quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures reliability and durability under various conditions.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on printed circuit boards (PCBs).

No. of Bits: 16

A 16-bit counter provides a broad range of counting capabilities, suitable for complex digital applications.

Load or Preset Input: YES

The preset capability allows for greater flexibility in applications where specific count values need to be loaded.

Nominal Supply Voltage / Vsup: 5 V

Operating at a common 5V supply makes it compatible with many existing designs and power sources.

No. of Terminals: 14

The 14-terminal configuration accommodates various connection needs for diverse applications.

Package Style (Meter): SMALL OUTLINE

A small outline package style aids in the design of compact and high-density circuit layouts.

Propagation Delay (tpd): 18000 ns

A propagation delay of 18 microseconds indicates suitable performance for many timing-critical applications.

Maximum Operating Temperature: 125 °C

This high thermal tolerance ensures reliable performance in demanding environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering is standard in digital logic, making it straightforward to integrate into synchronous systems.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for its use in extreme environments, like aerospace and military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finishes enhance solderability and ensure reliable electrical connections over the product's lifetime.

Terminal Position: DUAL

The dual-terminal position allows for flexible mounting orientations in circuit designs.

Maximum Seated Height: 1.75 mm

A low seated height supports compact design, making it suitable for slim devices.

Width: 3.9 mm

Narrow width is perfect for space-limited PCB layouts, aiding in miniaturization.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3V allows versatility in powering the device, expanding its use in battery-operated applications.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds indicates suitability for standard assembly processes in surface mount technology.

Peak Reflow Temperature: 260 °C

Withstands high peak reflow temperatures, ensuring it can survive modern soldering techniques.

Length: 8.65 mm

Compact length makes it suitable for dense electronic assemblies without taking up much space.

Temperature Grade: MILITARY

Military grade indicates high reliability and robustness, making it ideal for critical and harsh applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing performance and efficiency.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and are compatible with automated soldering processes.

Packing Method: TR

Taped and reeled packing method allows for automated handling and assembly, optimizing manufacturing efficiency.

Operation Mode: SYNCHRONOUS

Synchronous operation mode supports coordinated counting and better performance in multi-clock systems.

Terminal Pitch: 1.27 mm

A 1.27mm terminal pitch is standard for many applications, ensuring compatibility with a wide range of PCB designs.

Count Direction: UP

An upward counting direction makes this device suitable for applications requiring incremental counting.

Maximum Supply Voltage (Vsup): 20 V

The capability to operate at a maximum of 20V provides versatility for various high-voltage applications.

Technical Specifications

Digital Counters HCF4541M013TR attributes and parameters. Explore more Digital Counters devices from STMicroelectronics

Specs

Count Direction:

UP

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load or Preset Input:

YES

Logic IC Type:

Operation Mode:

SYNCHRONOUS

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

18000 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

HCF4541M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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