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HCF4053BTTR

STMicroelectronics

HCF4053BTTR by STMicroelectronics

HCF4053BTTR by STMicroelectronics is a versatile analog switch with 3 SPDT circuits, ideal for multiplexing and demultiplexing applications. It operates at a supply voltage of 3V to 20V, featuring a max on-state resistance of 280Ω and -40dB crosstalk at 6MHz. With an operating temp range of -55 °C to 125 °C, it's suitable for various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,754 parts In-Stock

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2,754

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Vyrian

USA . 2,227 parts In-Stock

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2,227

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Digiode

USA . 80 parts In-Stock

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 260 parts In-Stock

1+ parts

$0.422

100+ parts

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260

$0.422

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AZTECH Wire

Italy . 1,163 parts In-Stock

1+ parts

$16.960

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1,163

$16.960

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Component Stockers USA

USA . 303 parts In-Stock

1+ parts

$99.990

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303

$99.990

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MKK Technologies

India . 2,227 parts In-Stock

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2,227

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DigiPath Technology Company

USA . 2,227 parts In-Stock

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2,227

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Parana Technologies

USA . 2,089 parts In-Stock

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2,089

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IDEA Electronic Components Group

UK . 1,582 parts In-Stock

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1,582

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Corphita

USA . 1,572 parts In-Stock

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1,572

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Native Components

USA . 820 parts In-Stock

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820

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Northwest PG Solutions

USA . 801 parts In-Stock

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801

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Overview

Unlock the potential of your designs with the HCF4053BTTR from STMicroelectronics, a trusted name in innovation and quality. This versatile analog switch excels in multiplexing and demultiplexing applications, offering reliable performance and minimal on-state resistance. With an impressive operating temperature range and exceptional crosstalk suppression, you'll enjoy seamless integration in diverse projects. Elevate your circuit designs with STMicroelectronics' commitment to excellence and redefine efficiency today!

Feature Benefit Bullets

Other Names: 497-2383-1, 497-2383-2

Multiple part numbers enhance compatibility and ease of identification for users.

Standard Package: 2,500

Large standard package quantity ensures availability for bulk orders, ideal for large-scale production.

Category: Integrated Circuits (ICs) - Interface

Categorized under integrated circuits provides a clear indication of its application in electronic systems.

Analog Switches, Multiplexers, Demultiplexers

Versatile functionality enables use in a variety of applications requiring signal routing.

Packaging: Tape & Reel (TR), Cut Tape (CT)

Flexible packaging options cater to different manufacturing processes and user preferences.

Switch Circuit: SPDT

Single Pole Double Throw configuration provides efficient switching capabilities for diverse applications.

Multiplexer/Demultiplexer Circuit: 2:1

Enables routing of a single input to multiple outputs or vice versa, enhancing circuit efficiency and complexity.

Number of Circuits: 3

Three circuits allow for simultaneous operations, increasing efficiency and reducing component count.

On-State Resistance (Max): 280 Ohm

Low on-state resistance minimizes power loss, making it suitable for high-efficiency applications.

Channel-to-Channel Matching (ΔRon): 5 Ohm

Excellent channel matching ensures consistent performance across circuits, simplifying design and enhancing reliability.

Voltage - Supply, Single (V+): 3V ~ 20V

Wide supply voltage range accommodates various application needs, providing flexibility in design.

-3db Bandwidth: 60 MHz

High bandwidth supports fast signal processing, making it ideal for high-speed applications.

Channel Capacitance (CS(off), CD(off)): 0.2 pF, 5 pF

Low channel capacitance allows for minimal signal distortion, enhancing overall performance.

Current - Leakage (IS(off)) (Max): 100 nA

Low leakage current improves power efficiency and extends battery life in portable devices.

Crosstalk: -40 dB @ 6 MHz

Low crosstalk ensures signal integrity between channels, making it suitable for sensitive applications.

Operating Temperature: -55 °C ~ 125 °C (TA)

Wide operating temperature range enables reliable operation in extreme environments, suitable for industrial applications.

Supplier Device Package: 16-TSSOP

Compact package size allows for space-saving designs, ideal for modern electronic applications.

Base Product Number: HCF4053

Established base product number signifies reliability and trust in the market.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Unlimited MSL indicates robust handling and storage characteristics, reducing risk in supply chain management.

Technical Specifications

Additional Parts HCF4053BTTR attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Other Names:

497-2383-1
-497-2383-2
497-2383-2
-497-2383-1

Operating Temperature:

-55°C ~ 125°C (TA)

Category:

Integrated Circuits (ICs)
Interface Analog Switches, Multiplexers, Demultiplexers

Current - Leakage (IS(off)) (Max):

100nA

Crosstalk:

-40dB @ 6MHz

-3db Bandwidth:

60MHz

Supplier Device Package:

16-TSSOP

Standard Package:

2,500

Voltage - Supply, Single (V+):

3V ~ 20V

Channel-to-Channel Matching (ΔRon):

5Ohm

Channel Capacitance (CS(off), CD(off)):

0.2pF, 5pF

On-State Resistance (Max):

280Ohm

Switch Circuit:

SPDT

Packaging:

Tape & Reel (TR)
Cut Tape (CT)

Multiplexer/Demultiplexer Circuit:

2:1

Number of Circuits:

3

Base Product Number:

HCF4053

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

HCF4053BTTR Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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