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GAL16V8-20HB1

STMicroelectronics

GAL16V8-20HB1 by STMicroelectronics

STMicroelectronics' GAL16V8-20HB1 is a CMOS-based EE PLD with 18 inputs, 8 outputs, and 64 product terms. It offers a propagation delay of 20 ns and operates at a max clock frequency of 33.3 MHz. This PAL-type programmable logic device is commonly used in commercial applications requiring high-speed signal processing within a temperature range of 0 to 70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Anansix

USA . 2,783 parts In-Stock

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Digiode

USA . 2,541 parts In-Stock

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Vyrian

USA . 236 parts In-Stock

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Standard Data Resources

USA . 70 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Q Components

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Electronics Depot

USA . 3 parts In-Stock

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AZTECH Wire

Italy . 889 parts In-Stock

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$11.779

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Ampacity Inc.

Singapore . 1,141 parts In-Stock

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$21.000

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IDEA Electronic Components Group

UK . 1,886 parts In-Stock

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$161.060

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$144.954

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MKK Technologies

India . 820 parts In-Stock

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$302.862

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DigiPath Technology Company

USA . 820 parts In-Stock

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Argo Parts USA

USA . 2,939 parts In-Stock

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Continental Prestige Electronics

USA . 2,350 parts In-Stock

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Parana Technologies

USA . 1,853 parts In-Stock

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Corphita

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Aranea Global

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Overview

Elevate your electronics projects with the GAL16V8-20HB1 by STMicroelectronics, a top-tier Programmable Logic Device that boasts unmatched quality and reliability. Designed with cutting-edge CMOS technology, this device offers lightning-fast propagation delay and versatile PAL-type architecture. Perfect for a wide range of applications, from industrial automation to consumer electronics, this EE PLD is a game-changer in terms of performance and efficiency. Trust STMicroelectronics to deliver excellence in every package, ensuring that your projects are powered by the best in the industry. Unlock endless possibilities with the GAL16V8-20HB1 and experience unparalleled value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the internal components of the PLD.

Propagation Delay: 20 ns

Low propagation delay ensures fast signal processing and high-performance operation.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the PLD energy-efficient and reliable.

No. of Inputs: 18

With 18 inputs, the PLD can handle a wide range of input signals and data, making it versatile for different applications.

Nominal Supply Voltage (V): 5

Operating at a 5V supply voltage provides compatibility with standard power sources, ensuring ease of integration in various systems.

Maximum Clock Frequency: 33.3 MHz

With a high maximum clock frequency, the PLD can handle high-speed data processing and complex logic operations efficiently.

No. of Outputs: 8

Having 8 outputs allows the PLD to drive multiple external components or devices simultaneously, increasing the flexibility and functionality of the device.

Technical Specifications

Programmable Logic Devices (PLD) GAL16V8-20HB1 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from STMicroelectronics

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Macrocell

No. of Inputs:

18

No. of Product Terms:

64

Maximum Clock Frequency:

33.3 MHz

Propagation Delay:

20 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

GAL16V8-20HB1 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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