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ESDAXLC4-1BF3

STMicroelectronics

ESDAXLC4-1BF3 by STMicroelectronics

ESDAXLC4-1BF3 by STMicroelectronics is a single bidirectional avalanche diode with 5.5V breakdown voltage, 55W peak power dissipation, and 10V clamping voltage. It is used for transient suppression in electronic circuits, offering protection against voltage spikes during operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,520

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-

-

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Digiode

USA . 3,279 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,279

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-

-

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Bristol Electronics

USA . 1,696 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,696

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Dan-Mar Components

USA . 1,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,696

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-

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Anansix

USA . 1,071 parts In-Stock

1+ parts

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100+ parts

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1,071

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,282 parts In-Stock

1+ parts

$0.062

100+ parts

-

1k+ parts

$0.055

10k+ parts

-

1,282

$0.062

-

$0.055

-

MKK Technologies

India . 1,993 parts In-Stock

1+ parts

$0.116

100+ parts

-

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10k+ parts

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1,993

$0.116

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DigiPath Technology Company

USA . 1,993 parts In-Stock

1+ parts

$0.116

100+ parts

-

1k+ parts

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10k+ parts

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1,993

$0.116

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-

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Native Components

USA . 565 parts In-Stock

1+ parts

$12.130

100+ parts

-

1k+ parts

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565

$12.130

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Northwest PG Solutions

USA . 574 parts In-Stock

1+ parts

$13.343

100+ parts

$12.009

1k+ parts

-

10k+ parts

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574

$13.343

$12.009

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AZTECH Wire

Italy . 820 parts In-Stock

1+ parts

$18.060

100+ parts

-

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820

$18.060

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Perfect Parts

USA . 30,350 parts In-Stock

1+ parts

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100+ parts

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30,350

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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Corphita

USA . 4,480 parts In-Stock

1+ parts

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4,480

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Parana Technologies

USA . 859 parts In-Stock

1+ parts

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100+ parts

$0.074

1k+ parts

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10k+ parts

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859

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$0.074

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Overview

Upgrade your electronics with the ESDAXLC4-1BF3 by STMicroelectronics, a top-tier manufacturer known for quality and reliability. This Transient Suppression Device offers unparalleled protection and performance in a compact package, making it ideal for a wide range of applications. From safeguarding sensitive components to ensuring smooth operation, this product delivers value, benefits, and advantages that you can trust. Experience peace of mind knowing your electronics are in good hands with the ESDAXLC4-1BF3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Config: SINGLE

Simplifies installation and usage, making it easy to incorporate into electronic circuits.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and facilitating assembly.

Maximum Non Repetitive Peak Reverse Power Dissipation: 55 W

Can effectively handle high power surges, providing reliable protection for electronic devices.

Nominal Breakdown Voltage: 5.5 V

Provides precise protection at the specified voltage level, safeguarding connected components.

Maximum Operating Temperature: 125 °C

Capable of handling elevated temperatures without compromising performance, ensuring stability in various environments.

Minimum Breakdown Voltage: 14.2 V

Suitable for applications requiring protection at higher voltage levels, offering versatility in usage.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Designed specifically for transient suppression, effectively diverting excess voltage and safeguarding equipment.

Technology: AVALANCHE

Utilizes avalanche breakdown for efficient transient suppression, ensuring reliable protection against voltage spikes.

Maximum Clamping Voltage: 10 V

Limits voltage spikes to a safe level, preventing damage to sensitive electronic components.

Diode Element Material: SILICON

Offers high reliability and performance, making the product a durable and effective solution for transient suppression.

Technical Specifications

Transient Suppression Devices ESDAXLC4-1BF3 attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Minimum Breakdown Voltage:

14.2 V

Nominal Breakdown Voltage:

5.5 V

Maximum Clamping Voltage:

10 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBGA-B2

JESD-609 Code:

e1

Maximum Non Repetitive Peak Reverse Power Dissipation:

55 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Polarity:

BIDIRECTIONAL

Maximum Repetitive Peak Reverse Voltage:

3 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESDAXLC4-1BF3 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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