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ESDAVLC6-1BV2

STMicroelectronics

ESDAVLC6-1BV2 by STMicroelectronics

STMicroelectronics ESDAVLC6-1BV2 is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with 6V breakdown voltage and 18V clamping voltage. Utilizes AVALANCHE technology, ideal for transient suppression in surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,832 parts In-Stock

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8,832

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Digiode

USA . 4,433 parts In-Stock

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4,433

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Anansix

USA . 1,695 parts In-Stock

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1,695

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,770 parts In-Stock

1+ parts

$0.088

100+ parts

-

1k+ parts

$0.079

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1,770

$0.088

-

$0.079

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MKK Technologies

India . 1,225 parts In-Stock

1+ parts

$0.166

100+ parts

-

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1,225

$0.166

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DigiPath Technology Company

USA . 1,225 parts In-Stock

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$0.166

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-

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1,225

$0.166

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Native Components

USA . 55 parts In-Stock

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$1.200

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55

$1.200

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Northwest PG Solutions

USA . 409 parts In-Stock

1+ parts

$1.320

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409

$1.320

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AZTECH Wire

Italy . 171 parts In-Stock

1+ parts

$16.430

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171

$16.430

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Metaverse IC Inc.

Canada . 241,200 parts In-Stock

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241,200

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Perfect Parts

USA . 44,352 parts In-Stock

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44,352

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Kepictronics

USA . 20,000 parts In-Stock

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20,000

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A-Z Elektronik GmbH

Germany . 5,618 parts In-Stock

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5,618

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Corphita

USA . 4,762 parts In-Stock

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4,762

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Alle Elektronik GmbH

Germany . 3,745 parts In-Stock

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3,745

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Parana Technologies

USA . 399 parts In-Stock

1+ parts

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100+ parts

$0.106

1k+ parts

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399

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$0.106

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Overview

Protect your electronics with the reliable ESDAVLC6-1BV2 by STMicroelectronics. As a leader in transient suppression devices, STMicroelectronics ensures top-quality products for a wide range of applications. This surface mount diode boasts a nominal breakdown voltage of 6V and bidirectional polarity, offering maximum clamping voltage of 18V. With silicon diode element material and avalanche technology, this component provides superior protection against voltage spikes. Trust STMicroelectronics for cutting-edge technology that safeguards your devices effectively.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Nominal Breakdown Voltage: 6 V

Provides effective protection by clamping the voltage above 6V, preventing damage to sensitive electronics.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Specifically designed for transient voltage suppression, ensuring reliable protection against voltage spikes and surges.

Technology: AVALANCHE

Avalanche technology allows for rapid response to voltage spikes, diverting excess energy away from connected devices.

Polarity: BIDIRECTIONAL

Bidirectional polarity ensures protection against voltage spikes in both directions, enhancing overall reliability.

Maximum Clamping Voltage: 18 V

Limits the voltage across protected devices to a safe level (18V) during transient events, preventing damage.

Diode Element Material: SILICON

Silicon diodes are known for their high performance and reliability, making this product a durable choice for transient suppression.

Technical Specifications

Transient Suppression Devices ESDAVLC6-1BV2 attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Nominal Breakdown Voltage:

6 V

Maximum Clamping Voltage:

18 V

Diode Element Material:

SILICON

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity:

BIDIRECTIONAL

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ESDAVLC6-1BV2 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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