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ESDA14V2-4BF3

STMicroelectronics

ESDA14V2-4BF3 by STMicroelectronics

ESDA14V2-4BF3 by STMicroelectronics is a transient suppression device with common anode configuration and 5 elements. It has a max non-repetitive peak reverse power dissipation of 50W, breakdown voltage of 16.1V, and operates at temperatures up to 125°C. Ideal for protecting electronic circuits from electrostatic discharge in various applications.

Median Price

$0.169

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,241 parts In-Stock

1+ parts

$0.169

100+ parts

-

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1,241

$0.169

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DigiKey

USA . 4,618 parts In-Stock

1+ parts

$0.510

100+ parts

$0.198

1k+ parts

$0.132

10k+ parts

$0.119

4,618

$0.510

$0.198

$0.132

$0.119

Verical

USA . 1,241 parts In-Stock

1+ parts

-

100+ parts

$0.169

1k+ parts

-

10k+ parts

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1,241

-

$0.169

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Chip1Stop

Japan . 1,241 parts In-Stock

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1,241

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Distributors (In-Stock)

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Digiode

USA . 2,843 parts In-Stock

1+ parts

$0.159

100+ parts

-

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2,843

$0.159

-

-

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.263

100+ parts

-

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200

$0.263

-

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IBS Electronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.090

15,000

-

-

-

$0.090

ComSIT Distribution GmbH

Germany . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

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Vyrian

USA . 5,214 parts In-Stock

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5,214

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PC Components Company LLC

USA . 2,753 parts In-Stock

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2,753

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Bristol Electronics

USA . 2,753 parts In-Stock

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2,753

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Anansix

USA . 2,578 parts In-Stock

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2,578

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Semi Source

USA . 156 parts In-Stock

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156

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,137 parts In-Stock

1+ parts

$0.020

100+ parts

-

1k+ parts

-

10k+ parts

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3,137

$0.020

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IDEA Electronic Components Group

UK . 1,001 parts In-Stock

1+ parts

$0.040

100+ parts

-

1k+ parts

$0.036

10k+ parts

-

1,001

$0.040

-

$0.036

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Semicontronic

India . 12,708 parts In-Stock

1+ parts

$0.065

100+ parts

$0.063

1k+ parts

$0.063

10k+ parts

-

12,708

$0.065

$0.063

$0.063

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Ampacity Inc.

Singapore . 10,571 parts In-Stock

1+ parts

$0.065

100+ parts

-

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10,571

$0.065

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MKK Technologies

India . 1,079 parts In-Stock

1+ parts

$0.074

100+ parts

-

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1,079

$0.074

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DigiPath Technology Company

USA . 1,079 parts In-Stock

1+ parts

$0.074

100+ parts

-

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1,079

$0.074

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Corphita

USA . 1,572 parts In-Stock

1+ parts

$0.150

100+ parts

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1,572

$0.150

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Corohmni

South Africa . 56 parts In-Stock

1+ parts

$0.172

100+ parts

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56

$0.172

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Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$0.191

100+ parts

$0.174

1k+ parts

$0.157

10k+ parts

-

870

$0.191

$0.174

$0.157

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Continental Prestige Electronics

USA . 6,111 parts In-Stock

1+ parts

$0.263

100+ parts

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$0.258

6,111

$0.263

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-

$0.258

Argo Parts USA

USA . 2,481 parts In-Stock

1+ parts

$0.263

100+ parts

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1k+ parts

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10k+ parts

$0.255

2,481

$0.263

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-

$0.255

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.263

100+ parts

-

1k+ parts

$0.250

10k+ parts

$0.245

2,000

$0.263

-

$0.250

$0.245

AZTECH Wire

Italy . 62 parts In-Stock

1+ parts

$10.270

100+ parts

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62

$10.270

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iodParts Technologies Inc.

India . 10,000 parts In-Stock

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Lixinc

USA . 4,027 parts In-Stock

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4,027

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Parana Technologies

USA . 749 parts In-Stock

1+ parts

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100+ parts

$0.047

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749

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$0.047

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Overview

Experience superior quality and protection with the ESDA14V2-4BF3 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers reliable Transient Suppression Devices that guarantee safety and efficiency in various applications. With its common anode configuration and advanced technology, this product offers maximum protection against voltage spikes, ensuring peace of mind for customers. Trust STMicroelectronics to provide top-notch performance and durability for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it suitable for various applications.

Config: COMMON ANODE, 5 ELEMENTS

The common anode configuration with 5 elements allows for efficient and effective suppression of transient voltage spikes.

Surface Mount: YES

Being surface mountable, this device is easy to install and saves space on the circuit board.

Max Non Repetitive Peak Reverse Power Dissipation: 50 W

With a high power dissipation capability, this device can handle sudden spikes in voltage without damage.

Nominal Breakdown Voltage: 16.1 V

The breakdown voltage of 16.1V ensures optimal protection against voltage surges within the specified range.

Package Shape: SQUARE

The square shape of the package allows for easy placement and alignment on the circuit board.

No. of Terminals: 5

Having 5 terminals provides flexibility in connecting the device to the circuit, allowing for customized configurations.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and mechanical strength for reliable performance.

Max Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this device can withstand high temperatures in industrial environments.

Terminal Position: BOTTOM

The bottom terminal position ensures secure connections and easy integration into the circuit design.

Min Breakdown Voltage: 14.2 V

The minimum breakdown voltage of 14.2V provides protection against lower voltage fluctuations as well.

Max Breakdown Voltage: 18 V

With a maximum breakdown voltage of 18V, this device offers additional protection against higher voltage transients.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The diode type of trans voltage suppressor ensures efficient suppression of transient voltages for reliable circuit protection.

Technology: AVALANCHE

The avalanche technology used in this device allows for quick response and effective suppression of voltage spikes.

Terminal Form: BALL

The ball terminal form offers a secure connection and ease of installation for reliable performance.

No. of Elements: 5

Having 5 elements increases the suppression capability of the device, providing enhanced protection for the circuit.

Max Repetitive Peak Reverse Voltage: 12V

With a maximum repetitive peak reverse voltage of 12V, this device can withstand multiple voltage spikes without failure.

Polarity: BIDIRECTIONAL

The bidirectional polarity allows the device to protect against voltage spikes from both directions for comprehensive circuit protection.

Diode Element Material: SILICON

The use of silicon diode element material ensures stable and consistent performance for long-term reliability.

Technical Specifications

Transient Suppression Devices ESDA14V2-4BF3 attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

18 V

Minimum Breakdown Voltage:

14.2 V

Nominal Breakdown Voltage:

16.1 V

Config:

COMMON ANODE, 5 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

S-PBGA-B5

Maximum Non Repetitive Peak Reverse Power Dissipation:

50 W

No. of Elements:

5

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity:

BIDIRECTIONAL

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

12 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ESDA14V2-4BF3 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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