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E-STE101P

STMicroelectronics

E-STE101P by STMicroelectronics

E-STE101P by STMicroelectronics is a low-profile Ethernet transceiver designed for industrial applications. It operates at 3.3V with a data rate of 100 Mbps and features a temperature range from -40 °C to 85 °C. Its compact 64-terminal package ensures efficient surface mounting in network interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Semi Source

USA . 11,627 parts In-Stock

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Digiode

USA . 1,586 parts In-Stock

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Vyrian

USA . 1,446 parts In-Stock

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1,446

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Anansix

USA . 1,245 parts In-Stock

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Pegasus Components GmbH

Germany . 354 parts In-Stock

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354

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Ashlea Components Ltd

UK . 11 parts In-Stock

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Native Components

USA . 127 parts In-Stock

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$6.840

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127

$6.840

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IDEA Electronic Components Group

UK . 2,375 parts In-Stock

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$7.164

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$6.448

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2,375

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$6.448

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MKK Technologies

India . 459 parts In-Stock

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$13.472

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459

$13.472

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DigiPath Technology Company

USA . 459 parts In-Stock

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$13.472

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459

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Corphita

USA . 4,688 parts In-Stock

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Parana Technologies

USA . 991 parts In-Stock

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$8.566

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991

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Assy Fe

Spain . 120 parts In-Stock

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Northwest PG Solutions

USA . 17 parts In-Stock

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$6.703

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Overview

Elevate your network solutions with the E-STE101P from STMicroelectronics, a trusted leader in high-quality semiconductors. This robust Ethernet transceiver is designed for industrial applications, ensuring reliable performance even in harsh environments. With its compact low-profile design and efficient power usage, it seamlessly integrates into your projects, delivering unmatched speed and stability. Experience the superior quality that drives innovation and enhances connectivity, empowering your business to thrive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials in the package body ensures durability and resistance to environmental stress, making this product suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards, saving space and improving manufacturing efficiency.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCB layouts, making it easier to place multiple components without compromising performance.

Power Supplies (V): 3.3

Operating at 3.3V is standard for many digital circuits, ensuring compatibility and ease of integration with common systems.

No. of Terminals: 64

Having 64 terminals provides numerous connections for flexibility in design, enabling a wide range of functionalities and robust data communication.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design is excellent for applications where space is limited, while fine pitch enhances density without compromising performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for use in high-temperature environments, ensuring reliability in industrial settings.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C makes this transceiver ideal for harsh environments, such as outdoor or extreme condition usage.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold plating provides excellent conductivity and corrosion resistance, leading to improved longevity and reliability of connections.

Terminal Position: QUAD

Quad terminal positioning enhances signal integrity and reduces the likelihood of interference, critical for high-speed data communications.

Maximum Seated Height: 1.54 mm

The compact seated height allows for better stackability in low-profile applications, making this product suitable for portable devices and tight spaces.

Width: 10 mm

A width of 10 mm strikes a balance between size and performance, fitting nicely into various designs while providing ample connection points.

Length: 10 mm

The square dimensions (10 mm x 10 mm) are perfect for standard PCB layouts, facilitating easier integration and manufacturing.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, this product assures consistent performance in demanding operating conditions.

Technology: CMOS

CMOS technology provides low power consumption, making this transceiver energy-efficient and suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and mechanical stability during installation, ensuring a strong and reliable connection.

Telecom IC Type: ETHERNET TRANSCEIVER

As an Ethernet transceiver, this IC supports reliable and high-speed networking capabilities, essential for modern communication systems.

Nominal Supply Voltage: 3.3 V

Operating nominally at 3.3V aligns with many digital systems, simplifying integration and reducing the need for additional voltage regulation.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high density component placement, maximizing available board space while maintaining strong connectivity.

Data Rate: 100 Mbps

Supporting a data rate of 100 Mbps ensures efficient data transmission, suitable for many networking applications requiring stable connections.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 allows for moderate handling conditions before reflow, giving manufacturers flexibility during assembly without compromising part integrity.

Technical Specifications

Network Interfaces E-STE101P attributes and parameters. Explore more Network Interfaces devices from STMicroelectronics

Specs

Data Rate:

100 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.54 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

E-STE101P Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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