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E-L6562D

STMicroelectronics

E-L6562D by STMicroelectronics

E-L6562D by STMicroelectronics is a compact power factor controller designed for efficient switching regulation. It features a nominal input voltage of 12V, max output current of 0.8A, and operates in current-mode with pulse width modulation. Ideal for space-constrained applications, it comes in an 8-terminal SO package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,069 parts In-Stock

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3,069

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Digiode

USA . 2,796 parts In-Stock

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2,796

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Anansix

USA . 701 parts In-Stock

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701

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Distributors (Availability)

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Microchip USA

USA . 121 parts In-Stock

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$0.516

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121

$0.516

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Northwest PG Solutions

USA . 1,288 parts In-Stock

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$2.396

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$2.396

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IDEA Electronic Components Group

UK . 1,642 parts In-Stock

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$19.038

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$17.134

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$19.038

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$17.134

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AZTECH Wire

Italy . 562 parts In-Stock

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$21.980

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562

$21.980

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MKK Technologies

India . 221 parts In-Stock

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$35.799

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$35.799

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DigiPath Technology Company

USA . 221 parts In-Stock

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$35.799

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Component Stockers USA

USA . 336 parts In-Stock

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$99.990

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$99.990

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Parana Technologies

USA . 840 parts In-Stock

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$22.762

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Corphita

USA . 834 parts In-Stock

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Native Components

USA . 536 parts In-Stock

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$2.113

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Perfect Parts

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Overview

Elevate your designs with the E-L6562D from STMicroelectronics, a standout in switching regulators! Renowned for their commitment to quality and innovation, STMicroelectronics delivers exceptional performance and reliability across applications. This compact powerhouse not only optimizes energy efficiency but also ensures seamless integration into various systems. Experience unmatched value, enhanced design flexibility, and effortless operation, making it the ideal choice for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and thermal resistance of the product, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount integration allows for compact designs and efficient PCB space utilization, making it ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape ensures an efficient layout on PCBs, promoting better performance and heat dissipation.

No. of Terminals: 8

Eight terminals provide flexible connectivity options, facilitating easier integration into various circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient, which is essential for compact electronic applications.

Control Mode: CURRENT-MODE

Current-mode control enhances transient response and improves stability, making it a reliable choice for demanding applications.

Terminal Position: DUAL

Dual terminal positioning allows for better interconnectivity and can ease assembly processes in various applications.

Maximum Seated Height: 1.75 mm

This low profile design is ideal for space-constrained applications without sacrificing performance.

Width: 3.9 mm

A narrow width aids in minimizing board space usage, allowing for more components to be placed in tighter layouts.

Other IC type: POWER FACTOR CONTROLLER

As a power factor controller, it helps optimize power usage and enhances energy efficiency, crucial for eco-friendly designs.

Nominal Input Voltage: 12 V

The nominal input voltage aligns well with standard power supplies, simplifying design and integration processes.

Length: 4.9 mm

Short length contributes to compactness, facilitating the design of smaller devices that require less board real estate.

Maximum Output Current: 0.8 A

0.8 A output current capability is suitable for moderate load applications, offering a balance between performance and size.

Technology: BCDMOS

BCDMOS technology provides high efficiency and integration, leading to reduced power losses and improved thermal performance.

Terminal Form: GULL WING

Gull wing terminals ensure reliable soldering and easy handling during assembly, promoting robust connections.

Control Technique: PULSE WIDTH MODULATION

PWM control allows for efficient regulation of output voltage and current, ensuring optimal performance across varying loads.

Switcher Config: SINGLE

A single switcher configuration is straightforward and cost-effective for many applications, simplifying design complexity.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is a standard size that supports compatibility with many PCB layouts and assembly techniques.

Minimum Input Voltage: 10.3 V

A minimum input voltage of 10.3 V allows operation in a wide voltage range, thereby accommodating different supply sources.

Maximum Input Voltage: 22 V

Supporting a maximum input voltage of 22 V enables versatility and adaptability in various power supply applications.

Technical Specifications

Switching Regulators & Controllers E-L6562D attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

22 V

Minimum Input Voltage:

10.3 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Output Current:

.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Switcher Config:

SINGLE

Technology:

BCDMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

E-L6562D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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