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E-L3845D1

STMicroelectronics

E-L3845D1 by STMicroelectronics

E-L3845D1 by STMicroelectronics is an 8-SOIC RF interface IC designed for wireless modules. It features a surface mount design, comes in a tube package, and has an MSL of 1 for unlimited moisture sensitivity. Ideal for specialized applications in integrated circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,083 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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10,083

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Anansix

USA . 1,792 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,792

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Digiode

USA . 954 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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954

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EMSNET

USA . 147 parts In-Stock

1+ parts

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147

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 351 parts In-Stock

1+ parts

$3.242

100+ parts

-

1k+ parts

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10k+ parts

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351

$3.242

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AZTECH Wire

Italy . 881 parts In-Stock

1+ parts

$13.020

100+ parts

-

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881

$13.020

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Native Components

USA . 12 parts In-Stock

1+ parts

$43.569

100+ parts

-

1k+ parts

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10k+ parts

$41.826

12

$43.569

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-

$41.826

Northwest PG Solutions

USA . 242 parts In-Stock

1+ parts

$47.925

100+ parts

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242

$47.925

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Corphita

USA . 1,630 parts In-Stock

1+ parts

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1,630

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IDEA Electronic Components Group

UK . 762 parts In-Stock

1+ parts

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762

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Parana Technologies

USA . 531 parts In-Stock

1+ parts

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531

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MKK Technologies

India . 256 parts In-Stock

1+ parts

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256

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DigiPath Technology Company

USA . 256 parts In-Stock

1+ parts

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256

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Overview

Unlock the potential of your wireless applications with the E-L3845D1 from STMicroelectronics, a leader in innovative integrated circuits. Designed for reliability and performance, this specialized RF interface component enhances communication capabilities while ensuring seamless integration in various devices. Experience unmatched quality and support from a trusted manufacturer, empowering your projects with advanced technology that drives efficiency and innovation.

Feature Benefit Bullets

Standard Package: 100

Being packaged in units of 100 is ideal for bulk purchasing, making it suitable for large production runs or projects.

Category: Integrated Circuits (ICs)

As a part of the Integrated Circuits category, this product offers high functionality in compact size, essential for modern electronic designs.

Interface: Specialized

The specialized interface ensures optimal performance in specific applications, enhancing efficiency and reliability.

Packaging: Tube

Delivered in tube packaging, this product is protected during transit and storage, making it easy to handle and use in assembly processes.

Applications: Wireless Modules

Designed for wireless modules, this product is perfect for applications requiring robust communication capabilities.

Interface: RF

With an RF interface, this IC is suitable for radio frequency applications, facilitating seamless wireless communication.

Package / Case: 8-SOIC (0.154", 3.90mm Width)

The 8-SOIC package allows for compact designs while providing ample space for connections, making it easy to integrate into various PCB layouts.

Supplier Device Package: 8-SOIC

The supplier device package being 8-SOIC signifies compatibility with a range of circuit designs, enhancing versatility.

Mounting Type: Surface Mount

Surface mount technology (SMT) allows for automated installation, reducing assembly costs and time.

Base Product Number: L3845

Having a distinct base product number streamlines sourcing, ensuring that the exact part needed can be easily identified.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With a moisture sensitivity level of 1, this product can be stored indefinitely without concern of moisture damage, enhancing usability.

Technical Specifications

Additional Parts E-L3845D1 attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Category:

Integrated Circuits (ICs)
Interface Specialized

Applications:

Wireless Modules

Package / Case:

8-SOIC (0.154", 3.90mm Width)

Packaging:

Tube

Mounting Type:

Surface Mount

Interface:

RF

Supplier Device Package:

8-SOIC

Standard Package:

100

Base Product Number:

L3845

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

E-L3845D1 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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