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DVIULC6-2P6

STMicroelectronics

DVIULC6-2P6 by STMicroelectronics

DVIULC6-2P6 by STMicroelectronics is a unidirectional transient voltage suppressor diode designed for surface mount applications. It features a max clamping voltage of 17V, operates up to 125 °C, and has a compact 6-terminal square package. Ideal for protecting sensitive electronics from voltage spikes.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,100 parts In-Stock

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4,100

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Digiode

USA . 1,521 parts In-Stock

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1,521

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Anansix

USA . 1,425 parts In-Stock

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1,425

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 324 parts In-Stock

1+ parts

$0.107

100+ parts

-

1k+ parts

$0.096

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324

$0.107

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$0.096

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MKK Technologies

India . 1,778 parts In-Stock

1+ parts

$0.201

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-

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1,778

$0.201

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DigiPath Technology Company

USA . 1,778 parts In-Stock

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$0.201

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1,778

$0.201

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Benley Electronics

USA . 4 parts In-Stock

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$1.750

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4

$1.750

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AZTECH Wire

Italy . 595 parts In-Stock

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$12.190

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595

$12.190

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Perfect Parts

USA . 16,218 parts In-Stock

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16,218

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Kepictronics

USA . 11,800 parts In-Stock

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11,800

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Corphita

USA . 3,743 parts In-Stock

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3,743

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Northwest PG Solutions

USA . 2,245 parts In-Stock

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2,245

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Parana Technologies

USA . 2,210 parts In-Stock

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$0.128

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2,210

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$0.128

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A-Z Elektronik GmbH

Germany . 2,100 parts In-Stock

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2,100

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Alle Elektronik GmbH

Germany . 1,400 parts In-Stock

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Native Components

USA . 482 parts In-Stock

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482

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Overview

Elevate your designs with the DVIULC6-2P6 from STMicroelectronics, a trusted leader in innovative electronic components. This advanced transient suppression device ensures exceptional protection against voltage spikes, enhancing the reliability of your systems. Its compact design and robust materials make it perfect for various applications, while the superior quality of STMicroelectronics guarantees long-lasting performance. Safeguard your projects effortlessly with this high-value solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making this device suitable for rugged applications.

Config: SINGLE

A single configuration simplifies design and integration into circuits, reducing space requirements and potential for error.

Surface Mount: YES

Surface mount capability allows for efficient placement on PCBs, enabling higher circuit density and reducing assembly time.

Package Shape: SQUARE

The square shape facilitates optimal use of available space on the PCB, which can improve overall circuit design efficiency.

No. of Terminals: 6

With six terminals, this device provides flexible connection options, aiding in versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for compact designs, making it ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

A high operating temperature rating ensures reliable performance in demanding conditions, enhancing device longevity.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish provides superior conductivity and corrosion resistance, promoting long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for easy integration into various circuit layouts, enhancing design flexibility.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

This type effectively suppresses transient voltage spikes, protecting sensitive components and enhancing circuit safety.

Technology: AVALANCHE

Avalanche technology provides rapid response to transient events, improving overall circuit protection and reliability.

Terminal Form: FLAT

Flat terminals facilitate better soldering and connection stability, which is crucial for maintaining electrical performance.

Polarity: UNIDIRECTIONAL

Unidirectional polarity helps prevent reverse voltage damage, making it suitable for certain circuit applications.

Maximum Clamping Voltage: 17 V

A low clamping voltage ensures that the device effectively limits voltage levels during spikes, safeguarding downstream components.

Diode Element Material: SILICON

Silicon as a diode element material provides excellent electrical characteristics, contributing to the efficiency and effectiveness of the device.

Technical Specifications

Transient Suppression Devices DVIULC6-2P6 attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Maximum Clamping Voltage:

17 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

S-PDSO-F6

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Polarity:

UNIDIRECTIONAL

Qualification:

Not Qualified

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

Trade Compliance

DVIULC6-2P6 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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