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BZW50-180RL

STMicroelectronics

BZW50-180RL by STMicroelectronics

BZW50-180RL by STMicroelectronics is a single transient suppression device with 5000W peak power dissipation and 5uA reverse current. It is an avalanche technology diode with 180V max repetitive peak reverse voltage, ideal for UL recognized applications requiring high clamping voltage protection.

Median Price

$1.491

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 928 parts In-Stock

1+ parts

$3.520

100+ parts

$1.602

1k+ parts

$1.305

10k+ parts

-

928

$3.520

$1.602

$1.305

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Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.491

10k+ parts

-

2,000

-

-

$1.491

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Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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$1.491

10k+ parts

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2,000

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$1.491

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Avnet

USA . 1,000 parts In-Stock

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1,000

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Distributors (In-Stock)

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Digiode

USA . 4,577 parts In-Stock

1+ parts

$2.574

100+ parts

-

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4,577

$2.574

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Flip Electronics

USA . 25,000 parts In-Stock

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25,000

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Inventory MP

USA . 7,000 parts In-Stock

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7,000

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Bristol Electronics

USA . 5,000 parts In-Stock

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5,000

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Vyrian

USA . 4,278 parts In-Stock

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4,278

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Anansix

USA . 2,094 parts In-Stock

1+ parts

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2,094

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IBS Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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$1.508

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2,000

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-

$1.508

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Zilex Electronics Inc.

Canada . 1,107 parts In-Stock

1+ parts

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1,107

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First Choice Components Inc.

USA . 755 parts In-Stock

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755

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Chip Stock

USA . 145 parts In-Stock

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145

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 562 parts In-Stock

1+ parts

$0.082

100+ parts

-

1k+ parts

$0.074

10k+ parts

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562

$0.082

-

$0.074

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MKK Technologies

India . 627 parts In-Stock

1+ parts

$0.154

100+ parts

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627

$0.154

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DigiPath Technology Company

USA . 627 parts In-Stock

1+ parts

$0.154

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627

$0.154

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Corphita

USA . 937 parts In-Stock

1+ parts

$2.439

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937

$2.439

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Component Stockers USA

USA . 301 parts In-Stock

1+ parts

$3.570

100+ parts

$2.440

1k+ parts

$1.990

10k+ parts

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301

$3.570

$2.440

$1.990

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Perfect Parts

USA . 76,260 parts In-Stock

1+ parts

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76,260

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,569 parts In-Stock

1+ parts

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$0.098

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1,569

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$0.098

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Northwest PG Solutions

USA . 1,529 parts In-Stock

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1,529

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Native Components

USA . 406 parts In-Stock

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406

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Overview

Enhance the protection of your electronic devices with the BZW50-180RL transient suppression device by STMicroelectronics. Manufactured with precision and expertise, this product offers unparalleled quality and reliability for a wide range of applications. With its high power dissipation and low reverse current, customers can trust in the value and benefits that this device provides, ensuring optimal performance and safeguarding against transient voltage spikes. Upgrade your electronics with the BZW50-180RL and experience peace of mind knowing your devices are protected by top-of-the-line technology from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material ensures durability and reliability of the product, making it a suitable choice for protection against transient voltage spikes.

Maximum Non Repetitive Peak Reverse Power Dissipation: 5000 W

The high maximum non repetitive peak reverse power dissipation capability of 5000W indicates that the device can handle significant transient surges, offering effective protection for connected equipment.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of Trans Voltage Suppressor (TVS) diode technology ensures fast response times and effective suppression of voltage spikes, making the product ideal for transient suppression applications.

Maximum Clamping Voltage: 410 V

The low maximum clamping voltage of 410V ensures that the connected equipment is protected from voltage spikes by limiting the voltage to a safe level, enhancing the reliability of the product.

Technology: AVALANCHE

The use of Avalanche technology in the diode design allows for high power dissipation and fast response times, making the product suitable for handling transient surges effectively.

Technical Specifications

Transient Suppression Devices BZW50-180RL attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Minimum Breakdown Voltage:

200 V

Case Connection:

ISOLATED

Maximum Clamping Voltage:

410 V

Config:

SINGLE

Minimum Diode Capacitance:

1500 pF

Diode Element Material:

SILICON

JESD-30 Code:

O-PALF-W2

JESD-609 Code:

e3

Maximum Non Repetitive Peak Reverse Power Dissipation:

5000 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

LONG FORM

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

6.5 W

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Maximum Repetitive Peak Reverse Voltage:

180 V

Maximum Reverse Current:

5 uA

Sub-Category:

Transient Suppressors

Surface Mount:

NO

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

BZW50-180RL Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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