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BZW06-48BRL

STMicroelectronics

BZW06-48BRL by STMicroelectronics

BZW06-48BRL by STMicroelectronics is a single transient suppression device with 600W peak power dissipation and 5uA reverse current. It is an UL recognized bidirectional trans voltage suppressor diode ideal for protecting electronic circuits from voltage spikes in applications such as power supplies and communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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ACDS - Activité Composants Distribution Service

France . 14,500 parts In-Stock

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14,500

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Vyrian

USA . 8,328 parts In-Stock

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8,328

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Anansix

USA . 2,458 parts In-Stock

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2,458

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Digiode

USA . 684 parts In-Stock

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684

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,475 parts In-Stock

1+ parts

$0.072

100+ parts

-

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$0.065

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1,475

$0.072

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$0.065

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MKK Technologies

India . 1,105 parts In-Stock

1+ parts

$0.135

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1,105

$0.135

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DigiPath Technology Company

USA . 1,105 parts In-Stock

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$0.135

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1,105

$0.135

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Native Components

USA . 917 parts In-Stock

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$0.697

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917

$0.697

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Northwest PG Solutions

USA . 123 parts In-Stock

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$0.766

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123

$0.766

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AZTECH Wire

Italy . 819 parts In-Stock

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$8.460

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819

$8.460

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Component Stockers USA

USA . 426 parts In-Stock

1+ parts

$99.990

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426

$99.990

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Perfect Parts

USA . 32,480 parts In-Stock

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32,480

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Cyclops Electronics Ltd (Excess)

UK . 14,500 parts In-Stock

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14,500

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Glotronic Ltd.

UK . 11,600 parts In-Stock

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Corphita

USA . 1,494 parts In-Stock

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1,494

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Parana Technologies

USA . 320 parts In-Stock

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$0.086

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320

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$0.086

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Overview

Experience superior protection with the BZW06-48BRL Transient Suppression Device from STMicroelectronics. As a leader in innovative technology, STMicroelectronics has crafted a product that offers unmatched reliability and performance. Ideal for a variety of applications, this diode provides bidirectional voltage suppression, ensuring your electronics are safeguarded against power surges. Trust in the quality and expertise of STMicroelectronics to deliver the best solution for your transient suppression needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good protection and durability, making the product resistant to environmental factors and ensuring a long lifespan.

Maximum Non Repetitive Peak Reverse Power Dissipation: 600 W

The high maximum non repetitive peak reverse power dissipation allows the device to handle sudden spikes in voltage without getting damaged, providing reliable protection for connected equipment.

Maximum Reverse Current: 5 uA

The low maximum reverse current ensures minimal leakage and power loss, making the device efficient in energy consumption.

Package Shape: ROUND

The round package shape facilitates easy installation and integration into various electronic circuits and systems.

No. of Terminals: 2

The two terminals simplify the wiring process and provide a straightforward connection for the device within a circuit.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature range allows the device to function effectively in a wide range of environmental conditions, ensuring reliability in different applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and solderability, enabling secure connections and improving the overall performance of the device.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The trans voltage suppressor diode type is specifically designed for transient suppression, offering robust protection against voltage spikes and surges in electronic circuits.

Technology: AVALANCHE

The avalanche technology ensures rapid response and high surge handling capability, making the device suitable for applications requiring effective transient voltage suppression.

Maximum Repetitive Peak Reverse Voltage: 48 V

The maximum repetitive peak reverse voltage rating of 48 V indicates the device's ability to consistently suppress voltage spikes within this range, providing reliable protection for sensitive electronics.

Technical Specifications

Transient Suppression Devices BZW06-48BRL attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Minimum Breakdown Voltage:

53.2 V

Case Connection:

ISOLATED

Maximum Clamping Voltage:

100 V

Config:

SINGLE

Minimum Diode Capacitance:

350 pF

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-15

JESD-30 Code:

O-PALF-W2

JESD-609 Code:

e3

Maximum Non Repetitive Peak Reverse Power Dissipation:

600 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

LONG FORM

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

1.7 W

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Maximum Repetitive Peak Reverse Voltage:

48 V

Maximum Reverse Current:

5 uA

Sub-Category:

Transient Suppressors

Surface Mount:

NO

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

BZW06-48BRL Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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