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BZW06-13RL

STMicroelectronics

BZW06-13RL by STMicroelectronics

STMicroelectronics BZW06-13RL is a 600W TRANS VOLTAGE SUPPRESSOR DIODE with 13V max reverse voltage, 5uA reverse current, and 27.2V clamping voltage. Ideal for transient suppression in electronics to protect against voltage spikes.

Median Price

$0.126

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 94 parts In-Stock

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$0.126

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$0.126

Distributors (In-Stock)

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Digiode

USA . 477 parts In-Stock

1+ parts

$1.226

100+ parts

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477

$1.226

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ECAB

Sweden . 5,980 parts In-Stock

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5,980

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Vyrian

USA . 4,185 parts In-Stock

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Anansix

USA . 1,521 parts In-Stock

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1,521

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Cogito LLC

Ukraine . 1,308 parts In-Stock

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Zilex Electronics Inc.

Canada . 958 parts In-Stock

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958

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Distributors (Availability)

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.021

100+ parts

$0.019

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$0.017

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-

100

$0.021

$0.019

$0.017

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Corohmni

South Africa . 47 parts In-Stock

1+ parts

$0.025

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47

$0.025

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IDEA Electronic Components Group

UK . 1,855 parts In-Stock

1+ parts

$0.156

100+ parts

-

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$0.141

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1,855

$0.156

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$0.141

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MKK Technologies

India . 254 parts In-Stock

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$0.294

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254

$0.294

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DigiPath Technology Company

USA . 254 parts In-Stock

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$0.294

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254

$0.294

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Corphita

USA . 2,042 parts In-Stock

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$1.161

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2,042

$1.161

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Native Components

USA . 670 parts In-Stock

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$8.350

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670

$8.350

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Northwest PG Solutions

USA . 212 parts In-Stock

1+ parts

$9.185

100+ parts

$8.267

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212

$9.185

$8.267

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Perfect Parts

USA . 20,132 parts In-Stock

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Parana Technologies

USA . 358 parts In-Stock

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$0.187

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358

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$0.187

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Overview

Experience the superior quality and reliability of STMicroelectronics with the BZW06-13RL Transient Suppression Device. Designed for a wide range of applications, this product offers unmatched protection against voltage spikes and surges, ensuring the safety of your electronic devices. With a maximum power dissipation of 1.7W and a minimum breakdown voltage of 14.3V, the BZW06-13RL provides peace of mind to customers looking for a durable and efficient solution. Trust STMicroelectronics for all your transient suppression needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to environmental factors, ensuring a long lifespan.

Maximum Non Repetitive Peak Reverse Power Dissipation: 600 W

With a high peak power dissipation capability, this product can effectively handle sudden surge currents and protect the connected devices.

Maximum Reverse Current: 5 uA

The low reverse current ensures minimal power loss and enhances the efficiency of the transient suppression device.

Maximum Clamping Voltage: 27.2 V

The high clamping voltage ensures that any transient voltage spikes above this level are clamped down effectively, protecting the connected equipment.

Reference Standard: UL RECOGNIZED

Being UL recognized, this product meets the safety and performance standards set by a reputable organization, providing assurance of quality and reliability.

Technical Specifications

Transient Suppression Devices BZW06-13RL attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Minimum Breakdown Voltage:

14.3 V

Case Connection:

ISOLATED

Maximum Clamping Voltage:

27.2 V

Config:

SINGLE

Minimum Diode Capacitance:

1900 pF

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-15

JESD-30 Code:

O-PALF-W2

JESD-609 Code:

e3

Maximum Non Repetitive Peak Reverse Power Dissipation:

600 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

LONG FORM

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

1.7 W

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Maximum Repetitive Peak Reverse Voltage:

13 V

Maximum Reverse Current:

5 uA

Sub-Category:

Transient Suppressors

Surface Mount:

NO

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

BZW06-13RL Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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