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BAT46SWFILM

STMicroelectronics

BAT46SWFILM by STMicroelectronics

BAT46SWFILM by STMicroelectronics is a Schottky rectifier diode with a max forward voltage of 0.25 V and can handle up to 150 °C. It features a compact surface mount design with 3 terminals, ideal for efficient power management in electronic circuits. Its dual element configuration supports versatile applications in various devices.

Median Price

$0.140

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 2,480 parts In-Stock

1+ parts

$0.140

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2,480

$0.140

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DF Sales Co.

USA . 2,480 parts In-Stock

1+ parts

$0.140

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-

1k+ parts

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2,480

$0.140

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Vyrian

USA . 6,798 parts In-Stock

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6,798

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Digiode

USA . 3,950 parts In-Stock

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3,950

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Prism Electronics

USA . 1,119 parts In-Stock

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1,119

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Anansix

USA . 1,042 parts In-Stock

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1,042

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 436 parts In-Stock

1+ parts

$0.111

100+ parts

-

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$0.100

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436

$0.111

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$0.100

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MKK Technologies

India . 416 parts In-Stock

1+ parts

$0.209

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416

$0.209

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DigiPath Technology Company

USA . 416 parts In-Stock

1+ parts

$0.209

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416

$0.209

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AZTECH Wire

Italy . 648 parts In-Stock

1+ parts

$8.460

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648

$8.460

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Component Stockers USA

USA . 316 parts In-Stock

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$99.990

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316

$99.990

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Kepictronics

USA . 63,000 parts In-Stock

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63,000

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Corphita

USA . 4,350 parts In-Stock

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4,350

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Parana Technologies

USA . 1,577 parts In-Stock

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$0.133

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1,577

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$0.133

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Native Components

USA . 857 parts In-Stock

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857

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Northwest PG Solutions

USA . 794 parts In-Stock

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794

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Overview

Elevate your projects with the BAT46SWFILM from STMicroelectronics, a premier choice in diodes and rectifiers. Renowned for its reliability and superior performance, this surface-mount diode boasts a compact design that fits seamlessly into your applications. With unmatched thermal stability and efficiency, it ensures optimal operation even under demanding conditions. Trust STMicroelectronics for cutting-edge technology that empowers your innovations, delivering exceptional value and benefits for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides excellent durability and protection against environmental factors, making the diode reliable for long-term use.

Config: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

The series connection and center tap configuration allow for flexible circuit design and enhanced performance in various applications.

Surface Mount: YES

Surface mount technology makes this diode easy to integrate into compact circuit boards, saving space and improving manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB and facilitates easier placement and soldering.

No. of Terminals: 3

Having three terminals allows for versatile connection options and better circuit functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a compact design, suitable for modern electronic devices where space is a premium.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliable performance in extreme conditions, making it suitable for a variety of applications.

Terminal Finish: MATTE TIN

Matte tin finish minimizes oxidation and ensures good solderability, enhancing the reliability of electrical connections.

Terminal Position: DUAL

Dual terminal position enhances flexibility in layout, allowing for better integration in different circuit designs.

Diode Type: RECTIFIER DIODE

Rectifier diodes are essential in power conversion applications, making this diode useful for a wide range of electronic devices.

Maximum Forward Voltage (VF): 0.25 V

The low forward voltage drop increases efficiency and reduces energy loss in the circuit.

Maximum Output Current: 0.15 A

An output current rating of 0.15 A is sufficient for various low to medium power applications.

Technology: SCHOTTKY

Schottky technology provides fast switching speeds and lower forward voltage drop, making it ideal for high-frequency applications.

Terminal Form: GULL WING

Gull wing terminals are designed for improved mechanical strength and reliability of solder joints.

No. of Elements: 2

Having two elements allows for better current handling and improved performance in rectification applications.

Maximum Repetitive Peak Reverse Voltage: 100 V

A high peak reverse voltage capacity ensures durability and prevents breakdown in demanding conditions.

Maximum Non Repetitive Peak Forward Current: 1 A

This rating allows for handling brief surges of current, making it a robust choice for applications with variable loads.

Diode Element Material: SILICON

Silicon is a widely used material in diodes that provides excellent electrical characteristics and thermal stability.

Technical Specifications

Diodes & Rectifiers BAT46SWFILM attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Config:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.25 V

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

1 A

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

.15 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

100 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

BAT46SWFILM Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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