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BAT46SFILM

STMicroelectronics

BAT46SFILM by STMicroelectronics

BAT46SFILM by STMicroelectronics is a Schottky rectifier diode with a max forward voltage of 0.25 V and supports up to 100 V peak reverse voltage. It features a compact surface mount design with 3 terminals, ideal for space-constrained applications. Operating at up to 150 °C, it’s perfect for efficient power management in electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 11,365 parts In-Stock

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North Shore Components

USA . 2,962 parts In-Stock

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2,962

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Vyrian

USA . 2,318 parts In-Stock

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2,318

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Anansix

USA . 2,171 parts In-Stock

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2,171

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Digiode

USA . 681 parts In-Stock

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Prism Electronics

USA . 78 parts In-Stock

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78

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IDEA Electronic Components Group

UK . 157 parts In-Stock

1+ parts

$0.044

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-

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$0.040

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157

$0.044

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$0.040

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MKK Technologies

India . 2,270 parts In-Stock

1+ parts

$0.083

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2,270

$0.083

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DigiPath Technology Company

USA . 2,270 parts In-Stock

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$0.083

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2,270

$0.083

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AZTECH Wire

Italy . 646 parts In-Stock

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$16.670

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646

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Kepictronics

USA . 306,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,251 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,167 parts In-Stock

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Corphita

USA . 3,008 parts In-Stock

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Assy Fe

Spain . 3,000 parts In-Stock

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Northwest PG Solutions

USA . 1,910 parts In-Stock

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Parana Technologies

USA . 806 parts In-Stock

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$0.053

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$0.053

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Native Components

USA . 261 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of efficiency with the BAT46SFILM from STMicroelectronics. This high-quality Schottky rectifier diode seamlessly combines superior performance and reliability, perfect for your next electronics project. With its compact design and exceptional thermal stability, it’s ideal for applications in energy management and signal processing. Choose BAT46SFILM for unmatched quality and the assurance that comes from a trusted global leader in semiconductor solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material choice offers excellent durability and thermal stability, ensuring reliable performance in various operating environments.

Config: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

The series configuration with a center tap helps in efficient voltage division, making it suitable for various applications requiring balanced power distribution.

Surface Mount: YES

Surface mount technology enables efficient PCB space utilization and allows for automated assembly processes, reducing production costs.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier layout on a PCB, leading to improved design flexibility in compact spaces.

No. of Terminals: 3

Three terminals provide versatile connection options, accommodating a wider range of circuit designs and configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes board space, making it ideal for high-density applications where component size is crucial.

Maximum Operating Temperature: 150 °C

The high operating temperature threshold ensures reliability and longevity in demanding thermal conditions, enhancing overall product durability.

Terminal Position: DUAL

Dual terminal positioning allows for easier routing and placement on PCBs, simplifying assembly and improving design efficiency.

Maximum Time At Peak Reflow Temperature: 40 s

This specification ensures that the diode can withstand the reflow soldering process without thermal damage, ensuring a reliable manufacturing process.

Peak Reflow Temperature: 260 °C

With a peak temperature tolerance of 260 °C, this diode can be used in high-temperature soldering processes, enhancing assembly flexibility.

Diode Type: RECTIFIER DIODE

As a rectifier diode, it is optimized for converting AC to DC, making it suitable for power supply applications where rectification is required.

Maximum Forward Voltage (VF): 0.25 V

A low forward voltage drop indicates high efficiency during conduction, minimizing power losses and improving overall circuit performance.

Maximum Output Current: 0.15 A

This output current rating is suitable for low to medium power applications, providing reliable performance in various electronic devices.

Technology: SCHOTTKY

Schottky technology provides fast switching times and low forward voltage drop, making this diode ideal for high-frequency applications and efficient power management.

Terminal Form: GULL WING

Gull wing terminals are designed for ease of soldering and enhanced mechanical strength, ensuring secure connections to the PCB.

No. of Elements: 2

Having two elements enhances the diode's performance characteristics, allowing for more effective current handling and improved reliability in circuits.

Maximum Repetitive Peak Reverse Voltage: 100 V

This high voltage rating makes the diode suitable for a variety of applications, including those that require reversing voltage handling without failure.

Maximum Non Repetitive Peak Forward Current: 1 A

The capability to handle high non-repetitive peak forward current ensures that the diode can safely manage transient loads, enhancing system robustness.

Diode Element Material: SILICON

Silicon as the diode material ensures stable electrical characteristics, making it a reliable choice for a broad range of electronic applications.

Technical Specifications

Diodes & Rectifiers BAT46SFILM attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Config:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.25 V

JESD-30 Code:

R-PDSO-G3

Maximum Non Repetitive Peak Forward Current:

1 A

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

.15 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

100 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

BAT46SFILM Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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