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BAT46FILM

STMicroelectronics

BAT46FILM by STMicroelectronics

BAT46FILM by STMicroelectronics is a Schottky rectifier diode in a small outline package, ideal for surface mount applications. It features a max forward voltage of 0.25 V, supports up to 100 V reverse voltage, and operates at temperatures up to 150 °C. This diode is perfect for efficient power management in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,908 parts In-Stock

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5,908

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Anansix

USA . 2,122 parts In-Stock

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2,122

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Digiode

USA . 673 parts In-Stock

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673

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,317 parts In-Stock

1+ parts

$0.022

100+ parts

-

1k+ parts

$0.020

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2,317

$0.022

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$0.020

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MKK Technologies

India . 1,775 parts In-Stock

1+ parts

$0.042

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-

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1,775

$0.042

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DigiPath Technology Company

USA . 1,775 parts In-Stock

1+ parts

$0.042

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-

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1,775

$0.042

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AZTECH Wire

Italy . 409 parts In-Stock

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$17.810

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409

$17.810

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Kepictronics

USA . 306,000 parts In-Stock

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306,000

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A-Z Elektronik GmbH

Germany . 6,329 parts In-Stock

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Corphita

USA . 4,962 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,219 parts In-Stock

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Parana Technologies

USA . 1,410 parts In-Stock

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$0.026

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1,410

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$0.026

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Lixinc

USA . 1,098 parts In-Stock

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1,098

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Native Components

USA . 937 parts In-Stock

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Northwest PG Solutions

USA . 877 parts In-Stock

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S.R.D Solutions

India . 155 parts In-Stock

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155

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Overview

Unlock unparalleled performance with the BAT46FILM from STMicroelectronics, a premier choice in diodes and rectifiers. Designed for efficiency, this compact, high-quality Schottky diode excels in versatility across various applications, ensuring reliability even in demanding environments. With STMicroelectronics' legacy of innovation, elevate your projects with enhanced power management and reduced energy loss—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers excellent protection against environmental factors, making the diode durable and reliable in various applications.

Config: SINGLE

A single configuration simplifies the design and is ideal for space-constrained applications, ensuring ease of integration into circuits.

Surface Mount: YES

Surface mount capability allows for automatic assembly processes, reducing manufacturing costs and improving production efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on printed circuit boards (PCBs), enabling compact designs.

No. of Terminals: 3

Having three terminals provides flexibility in circuit design and allows for additional functionalities like better current handling.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports high-density board layouts, making it an excellent choice for compact electronic devices.

Maximum Operating Temperature: 150 °C

Withstanding high operating temperatures enhances reliability in demanding environments, ensuring consistent performance.

Terminal Position: DUAL

Dual terminal positioning allows for better electrical performance and ease of soldering, improving overall connectivity.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds during soldering ensures reliable connections while minimizing thermal stress on the component.

Peak Reflow Temperature °C: 260

The capability to endure peak temperatures of 260 °C during soldering processes helps in maintaining solder joint reliability.

Diode Type: RECTIFIER DIODE

Being a rectifier diode, it is suited for converting AC to DC, making it valuable for power supply circuits.

Maximum Forward Voltage (VF): 0.25 V

A low forward voltage drop of 0.25 V results in higher efficiency and lower heat generation, enhancing the overall energy savings.

Maximum Output Current: 0.15 A

With a maximum output current of 0.15 A, this diode is suitable for low to moderate current applications, ensuring versatility.

Technology: SCHOTTKY

Schottky technology delivers faster switching speeds and lower conduction losses, making it ideal for high-frequency applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and ease of assembly, ensuring a reliable solder connection.

Maximum Repetitive Peak Reverse Voltage: 100 V

A high reverse voltage rating of 100 V allows this diode to be used in various applications without the risk of breakdown.

Maximum Non Repetitive Peak Forward Current: 1 A

The ability to handle non-repetitive peak forward currents of up to 1 A adds robustness and reliability in transient conditions.

Diode Element Material: SILICON

Silicon as the diode material ensures good thermal stability and electrical performance, enhancing the reliability of the device.

Technical Specifications

Diodes & Rectifiers BAT46FILM attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.25 V

JESD-30 Code:

R-PDSO-G3

Maximum Non Repetitive Peak Forward Current:

1 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

.15 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

100 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

BAT46FILM Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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