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BAT46CFILM

STMicroelectronics

BAT46CFILM by STMicroelectronics

BAT46CFILM by STMicroelectronics is a Schottky rectifier diode with a max forward voltage of 0.25 V and supports up to 100 V reverse voltage. It features a compact SO package, ideal for space-constrained applications. Operating at up to 150 °C, it’s perfect for high-temp electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,141 parts In-Stock

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2,141

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Vyrian

USA . 2,006 parts In-Stock

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2,006

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Digiode

USA . 1,474 parts In-Stock

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1,474

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,353 parts In-Stock

1+ parts

$0.017

100+ parts

-

1k+ parts

$0.015

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-

1,353

$0.017

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$0.015

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MKK Technologies

India . 2,148 parts In-Stock

1+ parts

$0.031

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-

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2,148

$0.031

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DigiPath Technology Company

USA . 2,148 parts In-Stock

1+ parts

$0.031

100+ parts

-

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2,148

$0.031

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Microchip USA

USA . 243 parts In-Stock

1+ parts

$0.510

100+ parts

$0.510

1k+ parts

$0.500

10k+ parts

$0.500

243

$0.510

$0.510

$0.500

$0.500

AZTECH Wire

Italy . 859 parts In-Stock

1+ parts

$14.810

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859

$14.810

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Kepictronics

USA . 306,000 parts In-Stock

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306,000

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Corphita

USA . 2,428 parts In-Stock

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2,428

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Northwest PG Solutions

USA . 2,299 parts In-Stock

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2,299

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Parana Technologies

USA . 2,066 parts In-Stock

1+ parts

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$0.020

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2,066

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$0.020

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A-Z Elektronik GmbH

Germany . 1,650 parts In-Stock

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1,650

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Alle Elektronik GmbH

Germany . 1,100 parts In-Stock

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1,100

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Native Components

USA . 379 parts In-Stock

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379

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Overview

Unlock unparalleled performance with the BAT46CFILM by STMicroelectronics. This high-quality Schottky rectifier diode combines advanced technology with exceptional reliability, making it perfect for a variety of applications from power management to signal processing. Its compact design and surface-mount capability ensure easy integration into your projects, delivering efficiency and durability. Choose STMicroelectronics for innovation that empowers your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this diode suitable for various applications.

Config: COMMON CATHODE, 2 ELEMENTS

This configuration allows for efficient rectification in circuit designs, improving overall performance in DC applications.

Surface Mount: YES

Being surface mount compatible allows for easy integration into automated assembly processes, saving time and cost in manufacturing.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for space-efficient designs, making it suitable for compact electronic devices.

No. of Terminals: 3

Having three terminals facilitates easy connection in electronic circuits, ensuring a straightforward implementation.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in minimizing board space usage, enhancing design flexibility.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this diode can function reliably in demanding thermal environments.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit layout, allowing for better design options.

Maximum Time At Peak Reflow Temperature (s): 40

The tolerance for prolonged exposure to peak reflow temperatures ensures durability during soldering processes.

Peak Reflow Temperature °C: 260

Able to withstand high peak reflow temperatures enhances compatibility with advanced manufacturing processes.

Diode Type: RECTIFIER DIODE

As a rectifier diode, this component is excellent for converting AC to DC, making it essential for power supply applications.

Maximum Forward Voltage (VF): 0.25 V

The low forward voltage drop contributes to improved efficiency and reduces power losses in the circuit.

Maximum Output Current: 0.15 A

With a maximum output current of 0.15 A, this diode is suitable for low-power applications, ensuring efficient operation.

Technology: SCHOTTKY

The Schottky technology allows for faster switching speeds and lower voltage drops, enhancing overall circuit performance.

Terminal Form: GULL WING

The gull wing terminal form offers excellent solder joint strength and reliability in surface mount applications.

No. of Elements: 2

Having two elements ensures that this diode can handle various voltage and current requirements effectively.

Maximum Repetitive Peak Reverse Voltage: 100 V

The capability to handle up to 100 V reverse voltage ensures the diode can be used in a wide range of applications.

Maximum Non-Repetitive Peak Forward Current: 1 A

This feature supports the diode's use in surge protection circuits, allowing the device to withstand brief current spikes.

Diode Element Material: SILICON

Utilizing silicon as the diode element material ensures good thermal conductivity and reliability in performance.

Technical Specifications

Diodes & Rectifiers BAT46CFILM attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Config:

COMMON CATHODE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.25 V

JESD-30 Code:

R-PDSO-G3

Maximum Non Repetitive Peak Forward Current:

1 A

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

.15 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

100 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

BAT46CFILM Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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