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BAT41-07P6FILM

STMicroelectronics

BAT41-07P6FILM by STMicroelectronics

BAT41-07P6FILM by STMicroelectronics is a Schottky rectifier diode with a max reverse voltage of 100 V and forward voltage drop of 0.45 V. It operates in temperatures from -65 °C to 150 °C, ideal for compact surface mount applications. With low reverse current (20 µA), it's perfect for efficient power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,546 parts In-Stock

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8,546

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Digiode

USA . 3,911 parts In-Stock

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3,911

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Anansix

USA . 2,131 parts In-Stock

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2,131

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 241 parts In-Stock

1+ parts

$0.140

100+ parts

-

1k+ parts

$0.126

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241

$0.140

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$0.126

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MKK Technologies

India . 2,039 parts In-Stock

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$0.263

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2,039

$0.263

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DigiPath Technology Company

USA . 2,039 parts In-Stock

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$0.263

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2,039

$0.263

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Native Components

USA . 184 parts In-Stock

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$0.410

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-

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$0.394

184

$0.410

-

-

$0.394

Northwest PG Solutions

USA . 1,619 parts In-Stock

1+ parts

$0.451

100+ parts

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$0.398

1,619

$0.451

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$0.398

AZTECH Wire

Italy . 195 parts In-Stock

1+ parts

$13.730

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195

$13.730

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Component Stockers USA

USA . 273 parts In-Stock

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$99.990

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273

$99.990

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Lixinc

USA . 15,227 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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Corphita

USA . 2,324 parts In-Stock

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2,324

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Parana Technologies

USA . 2,002 parts In-Stock

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$0.167

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$0.167

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Perfect Parts

USA . 251 parts In-Stock

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251

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Overview

Unlock superior performance in your designs with the BAT41-07P6FILM from STMicroelectronics, a leader in innovative semiconductor solutions. This Schottky rectifier diode combines high efficiency and reliability, ensuring minimal forward voltage drop and low reverse leakage. Its compact, surface-mount design is perfect for space-constrained applications, making it ideal for powering consumer electronics, automotive systems, and industrial controls. Experience quality you can trust, backed by ST's commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making the diode reliable in various applications.

Config: SEPARATE, 2 ELEMENTS

The separate configuration allows for flexibility in circuit design and easier integration into various layouts.

Surface Mount: YES

Surface mount capability enables compact designs and easier automated assembly, thus reducing manufacturing costs.

Maximum Reverse Current: 20 uA

A low reverse current signifies high efficiency and minimal leakage, enhancing circuit performance.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on PCBs, useful for tight layouts.

Reverse Test Voltage: 50 V

A robust reverse test voltage indicates the diode's reliability and capability to operate under higher voltage conditions.

No. of Terminals: 6

The presence of 6 terminals enables versatile connections for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides a compact solution ideal for space-constrained applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures the diode can function reliably in extreme environments.

Minimum Operating Temperature: -65 °C

This low minimum operating temperature allows for application in cold environments without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning simplifies connections and can improve thermal performance in designs.

Maximum Time At Peak Reflow Temperature: 30 s

A longer peak reflow time allows for better soldering outcomes, which can enhance overall product reliability.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature ensures compatibility with modern soldering processes and materials.

Diode Type: RECTIFIER DIODE

As a rectifier diode, it efficiently converts alternating current (AC) to direct current (DC), which is crucial for power supply applications.

Maximum Forward Voltage (VF): 0.45 V

A low forward voltage drop contributes to higher efficiency and less heat generation during operation.

Maximum Output Current: 0.2 A

With a maximum output current of 0.2 A, this diode can handle moderate loads, making it suitable for various applications.

Technology: SCHOTTKY

As a Schottky diode, it offers faster switching speeds and lower forward voltage drop, making it ideal for high-frequency applications.

Terminal Form: FLAT

Flat terminals aid in better thermal contact and ease of mounting on the circuit board.

No. of Elements: 2

Having 2 elements allows for higher efficiency and reliability in rectification processes.

Maximum Repetitive Peak Reverse Voltage: 100 V

A high maximum repetitive peak reverse voltage indicates the diode's ability to withstand voltage spikes, ensuring long-lasting performance.

Diode Element Material: SILICON

Silicon as the diode material offers excellent electrical and thermal properties, ensuring efficient operation and durability.

Technical Specifications

Diodes & Rectifiers BAT41-07P6FILM attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Config:

SEPARATE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.45 V

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Maximum Output Current:

.2 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

100 V

Maximum Reverse Current:

20 uA

Reverse Test Voltage:

50 V

Sub-Category:

Other Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BAT41-07P6FILM Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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