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ASM330LXHTR

STMicroelectronics

ASM330LXHTR by STMicroelectronics

ASM330LXHTR by STMicroelectronics is a compact, industrial-grade analog circuit with a 3V nominal voltage and operates b/w -40 °C to 85 °C. It features a thin profile grid array package with 16 terminals. Ideal for applications requiring reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,654 parts In-Stock

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3,654

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Vyrian

USA . 2,853 parts In-Stock

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2,853

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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Anansix

USA . 450 parts In-Stock

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,246 parts In-Stock

1+ parts

$19.076

100+ parts

-

1k+ parts

$17.169

10k+ parts

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2,246

$19.076

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$17.169

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MKK Technologies

India . 698 parts In-Stock

1+ parts

$35.872

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698

$35.872

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DigiPath Technology Company

USA . 698 parts In-Stock

1+ parts

$35.872

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698

$35.872

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Corphita

USA . 2,729 parts In-Stock

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2,729

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Northwest PG Solutions

USA . 1,833 parts In-Stock

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1,833

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Parana Technologies

USA . 945 parts In-Stock

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$22.808

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945

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$22.808

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Native Components

USA . 756 parts In-Stock

1+ parts

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756

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Futuretech Components

Singapore . 500 parts In-Stock

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500

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Overview

Experience unparalleled precision and reliability with the ASM330LXHTR from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for diverse applications, this compact motion sensor excels in harsh environments while delivering exceptional performance. Its robust design ensures longevity and efficiency, making it ideal for consumer electronics, industrial automation, and IoT devices. Elevate your projects with a trusted component that offers superior value and unmatched support from a renowned manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount compatibility allows for easier and more efficient assembly processes in modern electronics, improving manufacturing speed and reducing costs.

Package Shape: SQUARE

The square package shape optimizes space efficiency on PCB layouts, allowing designers to maximize the functionality of compact designs.

Nominal Supply Voltage (Vsup): 3 V

A nominal supply voltage of 3V is widely used in many applications, ensuring compatibility and ease of integration into existing systems.

No. of Terminals: 16

Having 16 terminals provides flexibility in connectivity options, allowing for more complex circuit designs and functionalities.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch of the grid array package design facilitate high-density mounting and are ideal for advanced applications with space constraints.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in industrial environments where temperature fluctuations may occur.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions (-40 °C) makes this product suitable for outdoor applications and harsh environments.

Terminal Position: BOTTOM

Bottom terminal positioning allows for more efficient use of space and better heat dissipation, contributing to overall reliability.

Maximum Seated Height: 1.1 mm

A low seated height of 1.1 mm enables integration into compact designs while maintaining performance, making it ideal for space-constrained applications.

Width: 3 mm

At only 3 mm wide, this product is perfect for applications requiring compact solutions without sacrificing functionality.

Other IC Type: ANALOG CIRCUIT

As an analog circuit IC, it is well-suited for various signal processing tasks, making it versatile for different applications.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V allows for flexible use in low-power applications, expanding its potential application range.

Length: 3 mm

A compact length of 3 mm complements its width, making it suitable for small devices and systems.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates reliability and stability in demanding environments, essential for long-term applications.

Terminal Form: BUTT

Butt terminal form enhances soldering capabilities, ensuring strong and reliable connections in electronic circuits.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for denser layouts, accommodating modern electronics that require more compact designs.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V offers flexibility for various applications while ensuring safe operating limits.

Technical Specifications

Other Function Semiconductors ASM330LXHTR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B16

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

ASM330LXHTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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