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AIS1200DSTR

STMicroelectronics

AIS1200DSTR by STMicroelectronics

AIS1200DSTR by STMicroelectronics is an accelerometer sensor with digital output. It operates b/w -40 °C to 125°C, suitable for automotive applications (AEC-Q100). With a supply voltage range of 6.5V to 30V, it features BCD technology and comes in a rectangular surface mount package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,493 parts In-Stock

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2,493

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Vyrian

USA . 125 parts In-Stock

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125

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Anansix

USA . 119 parts In-Stock

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119

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,932 parts In-Stock

1+ parts

$18.504

100+ parts

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$16.654

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1,932

$18.504

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$16.654

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MKK Technologies

India . 290 parts In-Stock

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$34.795

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290

$34.795

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DigiPath Technology Company

USA . 290 parts In-Stock

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$34.795

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290

$34.795

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Corphita

USA . 1,664 parts In-Stock

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1,664

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Parana Technologies

USA . 865 parts In-Stock

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$22.124

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865

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$22.124

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Native Components

USA . 841 parts In-Stock

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841

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Northwest PG Solutions

USA . 310 parts In-Stock

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310

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Overview

Upgrade your sensor solutions with the AIS1200DSTR by STMicroelectronics, a top-of-the-line accelerometer that guarantees precision and reliability for all your projects. With a maximum supply voltage of 30V and AEC-Q100 screening level, this sensor offers unparalleled performance in a compact package. Whether you're working on automotive applications or IoT devices, the AIS1200DSTR delivers accurate digital output and operates seamlessly in temperatures ranging from -40 to 125 °C. Elevate your designs with the cutting-edge technology and superior quality of STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the sensor in various environmental conditions.

Maximum Supply Voltage: 30 V

Higher maximum supply voltage allows for compatibility with a wide range of power sources, increasing flexibility in application.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures that the sensor meets stringent automotive industry standards for quality and performance.

Body Width: 7.5 inch

Compact body width makes the sensor suitable for applications with limited space constraints.

Sensors or Transducers Type: ACCELEROMETER

The accelerometer type enables accurate measurement of acceleration, making it ideal for applications such as motion sensing and vibration monitoring.

No. of Terminals: 16

Higher number of terminals provide more connection options and versatility in integrating the sensor into different systems.

Body Height: 2.3 mm

Low body height facilitates space-saving installation, particularly in compact electronic devices or assemblies.

Package Shape or Style: RECTANGULAR

Rectangular package shape offers a standardized form factor for easy integration into various electronic designs.

Minimum Supply Voltage: 6.5 V

Low minimum supply voltage requirement allows for efficient power consumption and operation in energy-efficient systems.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures the sensor's reliability and functionality across different temperature conditions.

Output Type: DIGITAL OUTPUT

Digital output simplifies data processing and communication, making it easier to interface the sensor with digital systems.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows the sensor to function reliably in harsh environmental conditions or extreme temperatures.

Technology: BCD

BCD technology offers precise and efficient signal processing capabilities for accurate and reliable sensor readings.

Body Length/Diameter: 10.3 mm

Compact body length/diameter facilitates easy placement and mounting of the sensor in various applications.

Mounting Feature: SURFACE MOUNT

Surface mount capability allows for convenient and secure installation of the sensor on PCBs or other surfaces, enhancing reliability and ease of assembly.

Technical Specifications

Other Function Sensors & Transducers AIS1200DSTR attributes and parameters. Explore more Other Function Sensors & Transducers devices from STMicroelectronics

Specs

Additional Features:

SEATED HGT CALCULATED

Body Width:

7.5 inch

Body Height:

2.3 mm

Body Length/Diameter:

10.3 mm

Mounting Feature:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Type:

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOP16,.4

Package Shape or Style:

Screening Level:

AEC-Q100

Sensors or Transducers Type:

Maximum Supply Voltage:

30 V

Minimum Supply Voltage:

6.5 V

Technology:

BCD

Trade Compliance

AIS1200DSTR Sensors & Transducers trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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