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74LCX541TTR

STMicroelectronics

74LCX541TTR by STMicroelectronics

74LCX541TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 8 ns, operating at a supply voltage of 2.7-3.6 V. It features a compact SOIC package and supports high-speed data transmission in military applications. Its robust design ensures reliable performance across -55 °C to 125°C.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 5 parts In-Stock

1+ parts

$1.150

100+ parts

$0.870

1k+ parts

$0.750

10k+ parts

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5

$1.150

$0.870

$0.750

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Vyrian

USA . 7,406 parts In-Stock

1+ parts

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Anansix

USA . 2,792 parts In-Stock

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2,792

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Bristol Electronics

USA . 2,494 parts In-Stock

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2,494

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Digiode

USA . 1,963 parts In-Stock

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1,963

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A2Z Electronics, Inc.

USA . 9 parts In-Stock

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9

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Semtec, LLC

USA . 5 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,465 parts In-Stock

1+ parts

$2.969

100+ parts

-

1k+ parts

$2.851

10k+ parts

$2.851

3,465

$2.969

-

$2.851

$2.851

AZTECH Wire

Italy . 231 parts In-Stock

1+ parts

$13.370

100+ parts

-

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231

$13.370

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IDEA Electronic Components Group

UK . 1,943 parts In-Stock

1+ parts

$16.762

100+ parts

-

1k+ parts

$15.086

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1,943

$16.762

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$15.086

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MKK Technologies

India . 2,220 parts In-Stock

1+ parts

$31.521

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-

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2,220

$31.521

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DigiPath Technology Company

USA . 2,220 parts In-Stock

1+ parts

$31.521

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-

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2,220

$31.521

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Native Components

USA . 715 parts In-Stock

1+ parts

$68.075

100+ parts

-

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$65.352

715

$68.075

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-

$65.352

Northwest PG Solutions

USA . 1,751 parts In-Stock

1+ parts

$74.882

100+ parts

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1,751

$74.882

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RC Electronics

USA . 94,394 parts In-Stock

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94,394

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Kepictronics

USA . 48,500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,328 parts In-Stock

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9,328

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A-Z Elektronik GmbH

Germany . 6,597 parts In-Stock

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6,597

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Corphita

USA . 4,353 parts In-Stock

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4,353

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Microchip USA

USA . 3,703 parts In-Stock

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3,703

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Parana Technologies

USA . 552 parts In-Stock

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$20.042

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552

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$20.042

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Perfect Parts

USA . 9 parts In-Stock

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Overview

Elevate your design with the 74LCX541TTR from STMicroelectronics! This robust bus driver and transceiver delivers exceptional performance with ultra-fast propagation delays, making it perfect for high-speed data applications. With a commitment to quality and innovation, STMicroelectronics ensures reliability in every component. Ideal for consumer electronics, automotive, and industrial systems, this device brings efficiency, versatility, and durability to your projects, empowering you to achieve superior results effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental stress, making the product suitable for a variety of applications.

Propagation Delay At Nominal Supply: 8 ns

A low propagation delay allows for faster signal transmission, enhancing overall performance in high-speed applications.

Surface Mount: YES

Surface mount technology enables compact design and easy integration into modern circuit boards, optimizing space and efficiency.

Package Shape: RECTANGULAR

The rectangular package shape ensures efficient use of PCB space and allows for easier placement and soldering during assembly.

No. of Bits: 8

With 8 bits, the device can handle substantial data transfer in parallel, making it ideal for applications requiring high data throughput.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V allows for lower power consumption, making it energy-efficient for battery-powered applications.

Power Supplies (V): 3.3

Compatibility with 3.3V power supplies ensures integration with most modern digital circuits and systems.

No. of Terminals: 20

With 20 terminals, the device offers multiple connection points, enhancing its versatility and usability in complex setups.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design allow for space-efficient configurations in densely packed electronics.

Maximum I (ol): 24 Amp

A maximum output current of 24 Amps enables the device to drive substantial loads, making it viable for demanding applications.

Propagation Delay (tpd): 9 ns

This additional propagation delay reinforces the capability for quick data processing and improved communication speed in systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this product reliable in harsh environments, suitable for military and aerospace applications.

Output Characteristics: 3-STATE

3-state output characteristics allow for better control of data flow, crucial in bus-oriented systems.

Minimum Operating Temperature: -55 °C

Operating at extremely low temperatures ensures functionality in diverse climatic conditions, perfect for outdoor and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This premium terminal finishing ensures reliable electrical connections and resistance to corrosion for longer operational life.

Terminal Position: DUAL

Dual terminal positioning facilitates flexible PCB design and can accommodate various layout requirements.

No. of Ports: 2

With 2 ports, the device can interface with multiple components, enhancing its functionality and application range.

Maximum Seated Height: 1.2 mm

A low seated height reduces the overall profile of the product, making it suitable for ultra-slim device designs.

Width: 4.4 mm

A compact width allows for efficient placement in tight spaces on PCBs.

Output Polarity: TRUE

True output polarity supports standard logic operations, making integration in digital systems straightforward.

Minimum Supply Voltage (Vsup): 2 V

The flexibility to operate at a low minimum supply voltage enhances compatibility with low-power devices and systems.

Maximum Time At Peak Reflow Temperature (s): 40

The tolerance for a longer peak reflow time ensures reliability during soldering processes, preventing damage to the device.

Peak Reflow Temperature °C: 260

The capability to withstand high peak reflow temperatures ensures compatibility with advanced manufacturing processes.

Length: 6.5 mm

A short length contributes to a compact design, which is essential for small form factor devices.

Temperature Grade: MILITARY

MIL-SPEC temperature ratings guarantee the product's reliability and performance under extreme conditions, suitable for military applications.

Technology: CMOS

CMOS technology allows for low power consumption and high speed, making it an excellent choice for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminal form provides reliable soldering and easier handling during PCB assembly.

Packing Method: TR

Tape and reel (TR) packing enables automated pick and place assembly, enhancing production efficiency.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for higher density PCB designs, accommodating more components in smaller areas.

Control Type: ENABLE LOW

Low enable control type simplifies the integration in systems requiring low-power device activation.

Maximum Supply Voltage (Vsup): 3.6 V

The ability to operate at a maximum supply voltage of 3.6V provides flexibility in power supply configurations.

Technical Specifications

Bus Driver & Transceivers 74LCX541TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.16,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

74LCX541TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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