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STP150NF55

STMicroelectronics

STP150NF55 by STMicroelectronics

STP150NF55 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 120 A, breakdown voltage of 55 V, and operates at up to 175 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$3.410

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 410 parts In-Stock

1+ parts

$3.410

100+ parts

$2.330

1k+ parts

$2.060

10k+ parts

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410

$3.410

$2.330

$2.060

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EBV Elektronik

Germany . 1,800 parts In-Stock

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-

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1,800

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Distributors (In-Stock)

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Digiode

USA . 3,499 parts In-Stock

1+ parts

$3.240

100+ parts

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3,499

$3.240

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Vyrian

USA . 4,007 parts In-Stock

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4,007

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ACDS - Activité Composants Distribution Service

France . 2,000 parts In-Stock

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2,000

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Anansix

USA . 1,751 parts In-Stock

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1,751

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 872 parts In-Stock

1+ parts

$1.608

100+ parts

-

1k+ parts

$1.447

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872

$1.608

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$1.447

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MKK Technologies

India . 1,299 parts In-Stock

1+ parts

$3.024

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-

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1,299

$3.024

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DigiPath Technology Company

USA . 1,299 parts In-Stock

1+ parts

$3.024

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1,299

$3.024

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Corphita

USA . 1,299 parts In-Stock

1+ parts

$3.069

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1,299

$3.069

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AZTECH Wire

Italy . 89 parts In-Stock

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$8.980

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89

$8.980

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Microchip USA

USA . 471 parts In-Stock

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$24.505

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471

$24.505

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RC Electronics

USA . 42,254 parts In-Stock

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42,254

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Kepictronics

USA . 13,000 parts In-Stock

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Perfect Parts

USA . 12,849 parts In-Stock

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12,849

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Cyclops Electronics Ltd (Excess)

UK . 3,714 parts In-Stock

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3,714

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Alle Elektronik GmbH

Germany . 1,975 parts In-Stock

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1,975

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Parana Technologies

USA . 874 parts In-Stock

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$1.923

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874

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$1.923

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Glotronic Ltd.

UK . 264 parts In-Stock

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264

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Overview

Unlock the power of efficiency with the STP150NF55 by STMicroelectronics, a top-tier N-channel Power FET designed for reliability and high-performance switching applications. Renowned for their commitment to quality, STMicroelectronics ensures this transistor delivers exceptional value, boasting impressive current handling and low on-resistance. Perfect for industrial and automotive use, it empowers your systems with robust performance, energy savings, and enhanced durability, making it an ideal choice for demanding projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good durability and protection against environmental factors, increasing the longevity of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide lower on-resistance and higher efficiency, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for added protection against back EMF, which is crucial in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET delivers fast operation and improved energy efficiency in various circuits.

Minimum DS Breakdown Voltage: 55 V

A breakdown voltage of 55V ensures that the FET can operate safely in higher voltage environments without risking damage.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on PCBs and simplifies the layout design.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides a strong mechanical connection and is preferred in applications that require greater durability.

Operating Mode: ENHANCEMENT MODE

Enhancement-mode FETs offer better performance in terms of gate voltage control and are suited for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 480 A

A high pulsed drain current capability of 480A allows this FET to handle surges, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 850 mJ

An avalanche energy rating of 850mJ indicates the FET’s resilience against transient voltage spikes, enhancing its reliability.

Maximum Drain Current (Abs) (ID): 120 A

The 120A maximum drain current supports high load applications, allowing it to manage significant power requirements.

No. of Terminals: 3

With 3 terminals, the FET provides a simple yet effective connection scheme, facilitating easy integration in circuits.

Maximum Power Dissipation (Abs): 300 W

A power dissipation rating of 300W ensures that the device can manage high power levels, making it suitable for heavyweight applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging allows for straightforward installation and enhances thermal dissipation, ideal for heat-intensive applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOS technology leads to lower power consumption and faster switching speeds compared to other technologies.

Maximum Operating Temperature: 175 °C

A high operating temperature rating of 175 °C ensures stability and performance in demanding thermal environments.

Transistor Element Material: SILICON

Silicon as a material ensures good performance, stability, and cost-effectiveness in semiconductor devices.

Terminal Finish: TIN

Tin finish provides excellent solderability and corrosion resistance, enhancing the reliability of electrical connections.

Maximum Drain Current (ID): 120 A

Repeated entry of this spec highlights the robust current handling capability, reinforcing its suitability for power applications.

Maximum Drain-Source On Resistance: 0.006 ohm

A low on-resistance indicates efficient operation with minimal power loss, leading to improved overall system performance.

Terminal Position: SINGLE

Single terminal positioning allows for simplified design and integration into various electronic circuits.

Case Connection: DRAIN

The case connection to the drain ensures optimal heat dissipation, essential for maintaining performance under high load.

Technical Specifications

Power Field Effect Transistors (FET) STP150NF55 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP150NF55 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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