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EFM32LG995F256G-F-BGA120

Silicon Labs

EFM32LG995F256G-F-BGA120 by Silicon Labs

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 120; Package Code: VFBGA; Package Shape: SQUARE;

Median Price

$4.300

Lifecycle Status

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7

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1k+

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Arrow

USA . 56 parts In-Stock

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Farnell

UK . 60 parts In-Stock

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$4.300

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$3.620

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$3.520

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60

$4.300

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$3.520

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Chip1Stop

Japan . 56 parts In-Stock

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$5.630

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Verical

USA . 56 parts In-Stock

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Digiode

USA . 283 parts In-Stock

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Vyrian

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Nova Conductors

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Ampacity Inc.

Singapore . 56 parts In-Stock

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$4.790

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Corphita

USA . 866 parts In-Stock

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$5.067

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Corohmni

South Africa . 41 parts In-Stock

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AZTECH Wire

Italy . 1,161 parts In-Stock

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Microchip USA

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Advanced Electronics

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Continental Prestige Electronics

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Argo Parts USA

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iodParts Technologies Inc.

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Technical Specifications

Microcontrollers EFM32LG995F256G-F-BGA120 attributes and parameters. Explore more Microcontrollers devices from Silicon Labs

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B120

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

93

No. of Terminals:

120

No. of Timers:

5

On Chip Data RAM Width:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA120,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

8192

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.98 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI, UART(2), USART, USB

Peripherals:

COMPARATOR, BOD, DMA(12), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-CH 12-BIT

Trade Compliance

EFM32LG995F256G-F-BGA120 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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