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EFM32GG11B820F2048IL120-B

Silicon Labs

EFM32GG11B820F2048IL120-B by Silicon Labs

EFM32GG11B820F2048IL120-B by Silicon Labs is a 32-bit microcontroller with 2-Ch 12-Bit DAC and ADC channels. It operates at up to 50 MHz, has 13 timers, and offers low power mode. Ideal for applications requiring high-speed processing, precision analog-to-digital conversion, and extensive peripheral connectivity like CAN, I2C, UART.

Median Price

$14.660

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Symmetry

USA . 1 parts In-Stock

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$14.660

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Digiode

USA . 455 parts In-Stock

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$13.927

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$13.927

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Vyrian

USA . 2,026 parts In-Stock

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Nova Conductors

Japan . 28 parts In-Stock

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Ampacity Inc.

Singapore . 282 parts In-Stock

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$12.460

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Corphita

USA . 684 parts In-Stock

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$13.194

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Continental Prestige Electronics

USA . 799 parts In-Stock

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$19.790

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$13.700

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Microchip USA

USA . 3,316 parts In-Stock

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$36.970

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$36.440

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$36.170

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$35.910

3,316

$36.970

$36.440

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$35.910

Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$58.439

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$58.439

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$58.439

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Corohmni

South Africa . 4 parts In-Stock

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$85.007

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Argo Parts USA

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Aranea Global

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Overview

Unlock the full potential of your projects with the EFM32GG11B820F2048IL120-B by Silicon Labs. As a leading manufacturer in the industry, Silicon Labs delivers top-quality microcontrollers that offer unparalleled performance and reliability. With a wide range of applications in various industries, this microcontroller stands out for its efficiency, low power consumption, and advanced features. Experience seamless connectivity, precise control, and innovative solutions with the EFM32GG11B820F2048IL120-B, making it the perfect choice for your next project. Elevate your designs and unleash your creativity with Silicon Labs at your side.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology offers easier assembly and allows for compact designs.

Maximum Supply Voltage: 3.8 V

Provides flexibility in power supply options for various applications.

On Chip Data RAM Width: 8

Wider data RAM allows for efficient data processing and storage.

Package Shape: SQUARE

Square package shape helps in uniform distribution of components and easier PCB layout.

Bit Size: 32

Higher bit size allows for processing larger chunks of data at a time.

DAC Channels: YES

Presence of DAC channels enables the generation of analog output signals.

No. of Terminals: 120

Higher number of terminals provide more connectivity options for peripherals and external devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch offers high density mounting and space-saving benefits.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliability in extreme environmental conditions.

CPU Family: CORTEX-M4

Utilizing Cortex-M4 CPU family provides high performance and efficiency in processing tasks.

Minimum Operating Temperature: -40 °C

Ability to operate in extremely low temperatures makes the product suitable for industrial and automotive applications.

Terminal Finish: NICKEL GOLD

Nickel gold terminal finish provides excellent conductivity and corrosion resistance.

ADC Channels: YES

Having ADC channels allows for analog inputs to be converted into digital data for processing.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and improves the overall PCB design layout.

ROM Words: 2097152

Large ROM size provides ample storage for program code and data.

Maximum Seated Height: 0.9 mm

Low seated height allows for thin device profiles and compact designs.

Digital To Analog Convertors: 2-Ch 12-Bit

Having 2-channel 12-bit DACs enables precise analog output generation.

Width: 7 mm

Compact width makes the product suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan support aids in testing and debugging during product development and manufacturing.

Peripherals: BOR, COMPARATOR(4), POR, RTC, RTCC, TIMER(13), WDT(2)

Rich set of peripherals enhance the capabilities and functionalities of the microcontroller for diverse applications.

Maximum Clock Frequency: 50 MHz

High clock frequency allows for quick data processing and overall faster operation.

Maximum Time At Peak Reflow Temperature (s): 40

Short reflow time at peak temperature ensures efficient soldering and assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable solder joints and durability.

Length: 7 mm

Compact length contributes to the overall small form factor of the product.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller design provides fast and efficient operation.

No. of Timers: 13

Multiple timers allow for precise timekeeping and event management in applications.

RAM Bytes: 524288

Generous RAM capacity provides sufficient memory for data processing and temporary storage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and improves thermal conductivity.

Analog To Digital Convertors: 2-Ch 12-Bit

Dual 12-bit ADCs allow for accurate conversion of analog signals into digital data.

Maximum Supply Current: 200 mA

Moderate supply current requirement helps in efficient power management.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage for compatibility with common power sources.

No. of DMA Channels: 24

Multiple DMA channels enable efficient data transfer between peripherals and memory.

No. of Serial I/Os: 12

Sufficient serial I/O interfaces for communication with external devices and peripherals.

PWM Channels: YES

PWM channels allow for precise control of output signals and motor control.

Connectivity: CAN(2), I2C(3), LEUART(2), UART(2), USART(6)

Diverse connectivity options enable the microcontroller to communicate with various devices and protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware and software.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and compact PCB designs.

Format: FLOATING POINT

Support for floating-point format enhances the processing capabilities for mathematical operations.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the device's robustness against moisture during storage and handling.

Speed: 72 rpm

Operates at a moderate speed suitable for various real-time applications and control systems.

Low Power Mode: YES

Inclusion of low power mode enhances energy efficiency and prolongs battery life.

On Chip Program ROM Width: 8

Wider on-chip program ROM width allows for larger program storage and execution efficiency.

No. of I/O Lines: 95

Abundance of I/O lines for interfacing with external sensors, actuators, and peripherals.

Technical Specifications

Microcontrollers EFM32GG11B820F2048IL120-B attributes and parameters. Explore more Microcontrollers devices from Silicon Labs

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B120

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

24

No. of I/O Lines:

95

No. of Serial I/Os:

12

No. of Terminals:

120

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA120,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

72 rpm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), LEUART(2), UART(2), USART(6)

Peripherals:

BOR, COMPARATOR(4), POR, RTC, RTCC, TIMER(13), WDT(2)

Analog To Digital Convertors:

2-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

EFM32GG11B820F2048IL120-B Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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