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UPD70F3370AM1GBA-GAH-AX

Renesas Electronics

UPD70F3370AM1GBA-GAH-AX by Renesas Electronics

Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;

Median Price

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Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,333 parts In-Stock

1+ parts

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5,333

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 184 parts In-Stock

1+ parts

$17.640

100+ parts

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1k+ parts

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184

$17.640

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Infinite Electronics LLP (Excess)

. 308 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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308

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Microchip USA

USA . 250 parts In-Stock

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1k+ parts

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250

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Technical Specifications

Microcontrollers UPD70F3370AM1GBA-GAH-AX attributes and parameters. Explore more Microcontrollers devices from Renesas Electronics

Specs

Bit Size:

32

CPU Family:

V850

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3/5.5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

47 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

UPD70F3370AM1GBA-GAH-AX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Renesas Electronics

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