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FM1808-120-P

Ramtron International

FM1808-120-P by Ramtron International

FRAM; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS; Peak Reflow Temperature (C): 240;

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Northwest PG Solutions

USA . 624 parts In-Stock

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Native Components

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Technical Specifications

FRAMs FM1808-120-P attributes and parameters. Explore more FRAMs devices from Ramtron International

Specs

Maximum Access Time:

120 ns

Minimum Data Retention Time:

10

Endurance:

10000000000 Write/Erase Cycles

JESD-30 Code:

R-PDIP-T28

Length:

37.4 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

240

Maximum Seated Height:

6.35 mm

Maximum Standby Current:

.00002 Amp

Minimum Standby Voltage:

4.5 V

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Manufacturer Highlights

Ramtron International

Ramtron International Corporation is dedicated to the design, development, and sale of ferroelectric RAM "FRAM" memory products. Ramtron's goal is become the dominant supplier of mixed-signal integrated circuit solutions enhanced by FRAM memory. Ramtron International was acquired by Cypress Semiconductor in October, 2012. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion. The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers.

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