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TOP261EG

Power Integrations

TOP261EG by Power Integrations

ANALOG CIRCUIT; No. of Terminals: 6; Package Code: HSZIP; Package Shape: RECTANGULAR; Surface Mount: NO; Terminal Pitch: 1.27 mm;

Median Price

$3.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 604 parts In-Stock

1+ parts

$2.580

100+ parts

$1.810

1k+ parts

$1.700

10k+ parts

-

604

$2.580

$1.810

$1.700

-

DigiKey

USA . 923 parts In-Stock

1+ parts

$3.080

100+ parts

$2.540

1k+ parts

$2.160

10k+ parts

-

923

$3.080

$2.540

$2.160

-

Mouser Electronics

USA . 505 parts In-Stock

1+ parts

$3.080

100+ parts

$2.540

1k+ parts

$2.160

10k+ parts

-

505

$3.080

$2.540

$2.160

-

Element14

Singapore . 904 parts In-Stock

1+ parts

$255.640

100+ parts

$210.410

1k+ parts

$174.890

10k+ parts

-

904

$255.640

$210.410

$174.890

-

EBV Elektronik

Germany . 3,744 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,744

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 80 parts In-Stock

1+ parts

$6.150

100+ parts

$4.100

1k+ parts

-

10k+ parts

-

80

$6.150

$4.100

-

-

NAC Semi

USA . 2,976 parts In-Stock

1+ parts

-

100+ parts

$9.190

1k+ parts

-

10k+ parts

$8.480

2,976

-

$9.190

-

$8.480

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kepictronics

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,000

-

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Technical Specifications

Other Function Semiconductors TOP261EG attributes and parameters. Explore more Other Function Semiconductors devices from Power Integrations

Specs

Other IC type:

JESD-30 Code:

R-PZIP-T6

JESD-609 Code:

e3

Length:

10.16 mm

No. of Functions:

1

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

NO

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.01 mm

Trade Compliance

TOP261EG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Power Integrations

Power Integrations, Inc., is a leading innovator in semiconductor technologies for high-voltage power conversion. Our products are key building blocks in the clean-power ecosystem, enabling the generation of renewable energy as well as the efficient transmission and consumption of power in a vast range of applications including appliances, mobile devices, computers and countless industrial applications. Energy-saving technologies such as our PowiGaN™ gallium-nitride technology and our EcoSmart™ energy-efficiency technology prevent billions of kilowatt-hours of energy waste each year, while our highly integrated chips save billions of electronic components each year. Reflecting the environmental benefits of our products, Power Integrations' stock is a component of clean-technology stock indices sponsored by Cleantech Group LLC and Clean Edge, and our Green Room provides a comprehensive guide to energy-efficiency standards around the world.

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