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UAA2062TS

Philips Semiconductors

UAA2062TS by Philips Semiconductors

Cordless Telephone ICs; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

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Digiode

USA . 4,812 parts In-Stock

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Vyrian

USA . 3,120 parts In-Stock

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Anansix

USA . 1,409 parts In-Stock

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One Stop Electronics

USA . 130 parts In-Stock

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$687.000

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UNI Independent Distributors

Spain . 8,099 parts In-Stock

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Corphita

USA . 4,584 parts In-Stock

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Kepictronics

USA . 206 parts In-Stock

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Technical Specifications

Cordless Phone ICs UAA2062TS attributes and parameters. Explore more Cordless Phone ICs devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.6

Qualification:

Not Qualified

Sub-Category:

Cordless Telephone ICs

Maximum Supply Current:

36 mA

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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