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TEA1118TD-T

Philips Semiconductors

TEA1118TD-T by Philips Semiconductors

Cordless Telephone ICs; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

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Anansix

USA . 1,453 parts In-Stock

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Vyrian

USA . 1,012 parts In-Stock

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Digiode

USA . 967 parts In-Stock

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One Stop Electronics

USA . 1,433 parts In-Stock

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UNI Independent Distributors

Spain . 7,074 parts In-Stock

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Corphita

USA . 3,250 parts In-Stock

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Technical Specifications

Cordless Phone ICs TEA1118TD-T attributes and parameters. Explore more Cordless Phone ICs devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2.9

Qualification:

Not Qualified

Sub-Category:

Cordless Telephone ICs

Maximum Supply Current:

1.4 mA

Nominal Supply Voltage:

2.9 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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