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TEA1062C4M1

Philips Semiconductors

TEA1062C4M1 by Philips Semiconductors

Telephone Circuits; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

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One Stop Electronics

USA . 1,645 parts In-Stock

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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UNI Independent Distributors

Spain . 6,756 parts In-Stock

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Corphita

USA . 2,756 parts In-Stock

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Technical Specifications

Telephone Line ICs TEA1062C4M1 attributes and parameters. Explore more Telephone Line ICs devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.4

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

1.35 mA

Nominal Supply Voltage:

3.4 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TEA1062C4M1 Telecommunications trade compliance attributes, and parameters.

NSN

5962-01-537-8583, 5962015378583

NIIN

015378583

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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