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PCF8582CP

Philips Semiconductors

PCF8582CP by Philips Semiconductors

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,246 parts In-Stock

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Anansix

USA . 573 parts In-Stock

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573

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Vyrian

USA . 510 parts In-Stock

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510

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Fibra_Brandt Electronic GMBH

Germany . 40 parts In-Stock

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Component Electronics Inc.

Canada . 3 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,178 parts In-Stock

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$5.000

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Corphita

USA . 4,572 parts In-Stock

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UNI Independent Distributors

Spain . 4,373 parts In-Stock

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Assy Fe

Spain . 5 parts In-Stock

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Technical Specifications

EEPROM PCF8582CP attributes and parameters. Explore more EEPROM devices from Philips Semiconductors

Specs

Minimum Data Retention Time:

10

Endurance:

100000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Serial Bus Type:

I2C

Maximum Standby Current:

.0000035 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2.5 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

PCF8582CP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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