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74AHCT1G08GV

Philips Semiconductors

74AHCT1G08GV by Philips Semiconductors

AND GATE; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSOP; Package Shape: RECTANGULAR;

Median Price

$0.192

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Verical

USA . 17,500 parts In-Stock

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Bristol Electronics

USA . 9,180 parts In-Stock

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$0.094

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$0.056

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$0.037

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ComSIT Distribution GmbH

Germany . 6,000 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

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Connector Distribution Corp

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Right Parts Inc.

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Digiode

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Anansix

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LIBRA Elektronik GmbH

Germany . 2,183 parts In-Stock

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Microfarads

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AZTECH Wire

Italy . 6,649 parts In-Stock

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$0.090

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Native Components

USA . 743 parts In-Stock

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$6.190

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One Stop Electronics

USA . 491 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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UNI Independent Distributors

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Corphita

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Glotronic Ltd.

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Kepictronics

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Supply Digital

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Northwest PG Solutions

USA . 1,577 parts In-Stock

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Technical Specifications

Logic Gates 74AHCT1G08GV attributes and parameters. Explore more Logic Gates devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Sub-Category:

Gates

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

74AHCT1G08GV Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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