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TLV431ASN1T1

Onsemi

TLV431ASN1T1 by Onsemi

TLV431ASN1T1 by Onsemi is a voltage reference IC with adjustable output (1.215-1.265V) and max current of 0.02A. It operates in industrial temperature range (-40 to 85 °C) and is ideal for precision voltage regulation in compact electronic devices.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

USA . 45,500 parts In-Stock

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Vyrian

USA . 6,824 parts In-Stock

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Digiode

USA . 1,467 parts In-Stock

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AZTECH Wire

Italy . 57 parts In-Stock

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$21.420

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$26.282

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$23.917

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$21.551

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$26.282

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$21.551

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RC Electronics

USA . 31,500 parts In-Stock

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Kulean Microsystems

USA . 8,125 parts In-Stock

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SupplyDigital Components

Austria . 6,834 parts In-Stock

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TANS Electronics

Latvia . 6,804 parts In-Stock

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Problanco Electronics

Mexico . 6,197 parts In-Stock

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Microchip USA

USA . 4,955 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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UHIMA Technologies

Türkiye . 146 parts In-Stock

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Corphita

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Corohmni

South Africa . 56 parts In-Stock

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Overview

Discover the TLV431ASN1T1 by Onsemi, a high-quality voltage reference that offers precision and reliability for various applications. Manufactured by Onsemi, a trusted name in the industry, this product boasts a trim or adjustable output, making it versatile for different needs. With a small outline and low profile package style, this voltage reference is easy to integrate into your designs. Whether you're working on industrial equipment or consumer electronics, the TLV431ASN1T1 provides consistent performance and stability, ensuring optimal functionality. Upgrade your projects with this exceptional voltage reference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this voltage reference lightweight and durable, ideal for various electronic applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Trim or Adjustable Output (V): YES

The ability to trim or adjust the output voltage ensures precise voltage regulation, making it suitable for demanding applications.

Minimum Output Voltage: 1.215 V

With a low minimum output voltage, this voltage reference can be utilized in applications requiring low voltage levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable performance in a wide range of environmental conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring a secure connection on the PCB.

Technology: BIPOLAR

The bipolar technology used in this voltage reference offers stable and accurate voltage references, essential for precise circuit operation.

Nominal Output Voltage: 1.24 V

The close-to-nominal output voltage of 1.24 V ensures consistent and reliable voltage references for various electronic circuits.

Technical Specifications

Voltage References TLV431ASN1T1 attributes and parameters. Explore more Voltage References devices from Onsemi

Specs

Additional Features:

OUTPUT CAN BE ADJUSTED FROM 1.24V TO 16V

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.02 A

Maximum Output Voltage:

1.265 V

Minimum Output Voltage:

1.215 V

Nominal Output Voltage:

1.24 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.26 mm

Sub-Category:

Voltage References

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

129.032 ppm/Cel

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trim or Adjustable Output (V):

YES

Width (mm):

1.3 mm

Trade Compliance

TLV431ASN1T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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