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TL431AIPG

Onsemi

TL431AIPG by Onsemi

TL431AIPG by Onsemi is a voltage reference IC with adjustable output from 2.44V to 2.55V, ideal for industrial applications. It has a max output current of 0.1A and operates in temperatures ranging from -40 °C to 85°C. The package style is in-line with 8 terminals and a terminal pitch of 2.54mm, making it suitable for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,113 parts In-Stock

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Digiode

USA . 1,171 parts In-Stock

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AZTECH Wire

Italy . 804 parts In-Stock

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$14.980

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804

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Component Stockers USA

USA . 310 parts In-Stock

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$99.990

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310

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TANS Electronics

Latvia . 7,689 parts In-Stock

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Kulean Microsystems

USA . 7,097 parts In-Stock

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SupplyDigital Components

Austria . 5,840 parts In-Stock

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Problanco Electronics

Mexico . 3,314 parts In-Stock

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UHIMA Technologies

Türkiye . 720 parts In-Stock

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Corphita

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Microchip USA

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Corohmni

South Africa . 61 parts In-Stock

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Overview

Experience unmatched quality and reliability with the TL431AIPG voltage reference by Onsemi. This versatile component offers precision and stability in voltage regulation, making it ideal for a wide range of applications. From power supplies to industrial automation, this innovative product ensures optimal performance and efficiency. Trust Onsemi's expertise and reputation for excellence to deliver exceptional value and benefits to your projects. Upgrade your designs with the TL431AIPG and elevate your products to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the voltage reference, making it suitable for various environments.

Trim or Adjustable Output (V): YES

Allows for fine-tuning of the output voltage, making it versatile and customizable for different applications.

No. of Terminals: 8

Provides multiple connection points for flexibility in circuit design and application.

Minimum Output Voltage: 2.44 V

Ensures a stable and precise output voltage for consistent performance.

Minimum Operating Temperature: -40 °C

Allows the voltage reference to operate in extreme temperature environments without compromising functionality.

Maximum Output Voltage: 2.55 V

Provides a tight output voltage range for accurate voltage references in electronic circuits.

Maximum Seated Height: 4.45 mm

Compact size allows for space-saving installation in electronic devices.

Technology: BIPOLAR

Utilizes bipolar technology for improved accuracy and stability in voltage reference.

Technical Specifications

Voltage References TL431AIPG attributes and parameters. Explore more Voltage References devices from Onsemi

Specs

Additional Features:

OUTPUT VOLTAGE PROGRAMMABLE FROM 2.495V TO 36V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.78 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.1 A

Maximum Output Voltage:

2.55 V

Minimum Output Voltage:

2.44 V

Nominal Output Voltage:

2.495 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Voltage References

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

2.495 V

Surface Mount:

NO

Technology:

BIPOLAR

Max Voltage Temp Coef:

96.192 ppm/Cel

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trim or Adjustable Output (V):

YES

Width (mm):

7.62 mm

Trade Compliance

TL431AIPG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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