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TCT-102BB-FT

Onsemi

TCT-102BB-FT by Onsemi

TCT-102BB-FT by Onsemi is a RF/Microwave Antenna with 9 terminals, operating from -30 °C to 85°C. It supports EDGE, GSM, LTE, WDCMA applications at frequencies ranging from 600 MHz to 3800 MHz. The antenna has a characteristic impedance of 50 ohm and features a surface mount for easy installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,030 parts In-Stock

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Digiode

USA . 173 parts In-Stock

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Kulean Microsystems

USA . 4,262 parts In-Stock

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4,262

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Problanco Electronics

Mexico . 2,391 parts In-Stock

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SupplyDigital Components

Austria . 2,290 parts In-Stock

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Corphita

USA . 1,479 parts In-Stock

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UHIMA Technologies

Türkiye . 664 parts In-Stock

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TANS Electronics

Latvia . 645 parts In-Stock

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Corohmni

South Africa . 133 parts In-Stock

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Overview

Unlock the power of seamless connectivity with the TCT-102BB-FT by Onsemi. This RF/Microwave Antenna support circuit is a game-changer in the EDGE, GSM, LTE, and WDCMA applications. With a durable plastic/epoxy body construction and surface mounting feature, this component offers unmatched quality and reliability. Experience superior performance and extended temperature range from -30 to 85 °C. Trust Onsemi to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the TCT-102BB-FT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the antenna lightweight and durable, which is ideal for various applications.

No. of Terminals: 9

Having 9 terminals allows for versatile connections and compatibility with different systems or devices.

Application: EDGE, GSM, LTE, WDCMA

Support for multiple applications like EDGE, GSM, LTE, and WDCMA ensures wide compatibility and functionality in different networks.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the antenna to be used in various environmental conditions without performance degradation.

RF or Microwave Device Type: ANTENNA SUPPORT CIRCUIT

The antenna support circuit design ensures efficient signal transmission and reception, making it a reliable choice for RF/Microwave applications.

Minimum Operating Frequency: 600 MHz

The ability to operate at a minimum frequency of 600 MHz enables the antenna to cover a wide range of frequencies for different communication needs.

Mounting Feature: SURFACE MOUNT

The surface mount design allows for easy and convenient installation on circuit boards or other surfaces, making it suitable for compact and integrated systems.

Maximum Operating Frequency: 3800 MHz

With a high maximum operating frequency of 3800 MHz, the antenna can support high-speed data transmission and communication in advanced wireless networks.

Technical Specifications

RF/Microwave Antennas TCT-102BB-FT attributes and parameters. Explore more RF/Microwave Antennas devices from Onsemi

Specs

Application:

EDGE, GSM, LTE, WDCMA

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Mounting Feature:

No. of Elements:

1

No. of Terminals:

9

Maximum Operating Frequency:

3800 MHz

Minimum Operating Frequency:

600 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

Package Equivalence Code:

BGA9,3X4,16

RF or Microwave Device Type:

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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