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SURF81620CTG

Onsemi

SURF81620CTG by Onsemi

Limited Part Number Data;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

SURF81620CTG by Onsemi
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,482 parts In-Stock

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7,482

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Digiode

USA . 1,139 parts In-Stock

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1,139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,086 parts In-Stock

1+ parts

$22.010

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1,086

$22.010

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Component Stockers USA

USA . 789 parts In-Stock

1+ parts

$99.990

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789

$99.990

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Kulean Microsystems

USA . 7,938 parts In-Stock

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7,938

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Problanco Electronics

Mexico . 6,618 parts In-Stock

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6,618

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TANS Electronics

Latvia . 6,549 parts In-Stock

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6,549

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Corphita

USA . 2,383 parts In-Stock

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2,383

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Corohmni

South Africa . 382 parts In-Stock

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382

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SupplyDigital Components

Austria . 298 parts In-Stock

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298

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UHIMA Technologies

Türkiye . 186 parts In-Stock

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186

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Technical Specifications

Additional Parts SURF81620CTG attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Speed:

Standard Recovery >500ns, > 200mA (Io)

Category:

Discrete Semiconductor Products
Diodes Rectifiers Single Diodes

Package / Case:

TO-220-3 Full Pack

Technology:

Standard

Voltage - DC Reverse (Vr) (Max):

200 V

Package:

Tube

Mounting Type:

Through Hole

Current - Average Rectified (Io):

16A

Supplier Device Package:

TO-220FP

Standard Package:

50

Base Product Number:

SURF81

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

SURF81620CTG Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8541.10.0080

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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