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STF202-30T1

Onsemi

STF202-30T1 by Onsemi

STF202-30T1 by Onsemi is a DATA LINE FILTER with 33 ohm DC Resistance, 1.7mm Width, and 3.1mm Length. Ideal for surface mount applications in data line filtering due to its compact dimensions of L3.1XB1.7XH1.1 (mm).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,471 parts In-Stock

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Vyrian

USA . 104 parts In-Stock

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SupplyDigital Components

Austria . 6,448 parts In-Stock

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TANS Electronics

Latvia . 6,235 parts In-Stock

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Problanco Electronics

Mexico . 5,248 parts In-Stock

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Kulean Microsystems

USA . 3,805 parts In-Stock

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Corphita

USA . 936 parts In-Stock

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UHIMA Technologies

Türkiye . 696 parts In-Stock

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Corohmni

South Africa . 422 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the STF202-30T1 Data Line Filter by Onsemi. Manufactured with precision and expertise, this filter is designed to provide superior quality and reliability for a wide range of applications. With its compact size and easy surface mount installation, it offers convenience and efficiency to customers looking to improve signal integrity and reduce electromagnetic interference. Trust Onsemi to deliver cutting-edge technology that enhances the functionality of your electronics.

Feature Benefit Bullets

Filter Type: DATA LINE FILTER

A data line filter helps in reducing electromagnetic interference and noise, ensuring better signal quality.

Width (mm): 1.7

The compact width of 1.7mm allows for easy integration into electronic devices with limited space.

Maximum DC Resistance: 33 ohm

The maximum DC resistance of 33 ohm ensures efficient filtering of DC signals in data lines.

Length: 3.1 mm

The length of 3.1mm provides adequate filtering capability while maintaining a small footprint.

Packing Method: TAPE AND REEL

The tape and reel packing method facilitates automated assembly processes, saving time and effort.

Mounting Type: SURFACE MOUNT

The surface mounting type simplifies installation on printed circuit boards, making it suitable for mass production.

Dimensions: L3.1XB1.7XH1.1 (mm)/L0.122XB0.0669XH0.0433 (inch)

The compact dimensions of 3.1x1.7x1.1mm (0.122x0.0669x0.0433 inch) make this data line filter suitable for small electronic devices.

Height: 1.1 mm

The low height of 1.1mm allows for flexible placement within electronic assemblies without adding bulk.

Technical Specifications

Data Line Filters STF202-30T1 attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Maximum DC Resistance:

Filter Type:

Height:

1.1 mm

Length:

3.1 mm

Manufacturer Series:

STF202-30T1

Mounting Type:

SURFACE MOUNT

No. of Functions:

1

Packing Method:

TAPE AND REEL

Dimensions:

L3.1XB1.7XH1.1 (mm)/L0.122XB0.0669XH0.0433 (inch)

Width (mm):

1.7

Trade Compliance

STF202-30T1 Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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