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SPS1M001B

Onsemi

SPS1M001B by Onsemi

The Onsemi SPS1M001B is a rectangular humidity sensor with a body width of 20in and length of 166.5mm. It operates b/w -40 °C to 85°C, making it suitable for various applications requiring precise humidity measurements in surface mount installations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,924 parts In-Stock

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Digiode

USA . 1,888 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 1,036 parts In-Stock

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$10.540

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1,036

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TANS Electronics

Latvia . 6,275 parts In-Stock

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SupplyDigital Components

Austria . 5,583 parts In-Stock

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Kulean Microsystems

USA . 2,352 parts In-Stock

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Corphita

USA . 1,691 parts In-Stock

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Problanco Electronics

Mexico . 1,185 parts In-Stock

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Corohmni

South Africa . 451 parts In-Stock

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UHIMA Technologies

Türkiye . 285 parts In-Stock

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Overview

Discover the superior quality and reliability of the SPS1M001B by Onsemi, a leading manufacturer in the industry. This humidity sensor offers unmatched precision and accuracy, making it ideal for a wide range of applications. From environmental monitoring to industrial processes, this sensor provides valuable insights that can improve efficiency and performance. Trust Onsemi to deliver cutting-edge technology that enhances your systems and drives success.

Feature Benefit Bullets

Body Width: 20 inch

The 20 inch body width allows for easy installation and integration into various systems or equipment.

Sensors or Transducers Type: HUMIDITY SENSOR

The inclusion of a humidity sensor enhances the functionality of the product, making it suitable for applications where monitoring humidity levels is important.

Package Shape or Style: RECTANGULAR

The rectangular shape of the package provides a stable and secure fit when mounted, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high temperature environments, increasing its versatility.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this product suitable for a wide range of environments, including cold storage facilities.

Body Length/Diameter: 166.5 mm

The 166.5 mm body length/diameter provides a compact and space-saving design, ideal for applications where size constraints are a concern.

Mounting Feature: SURFACE MOUNT

The surface mount feature simplifies the installation process, allowing for quick and easy mounting on surfaces, boards, or enclosures.

Technical Specifications

Other Function Sensors & Transducers SPS1M001B attributes and parameters. Explore more Other Function Sensors & Transducers devices from Onsemi

Specs

Body Width:

20 inch

Body Length/Diameter:

166.5 mm

Mounting Feature:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

MODULE(UNSPEC)

Package Shape or Style:

Sensors or Transducers Type:

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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