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P3PSL450AG-08CR

Onsemi

P3PSL450AG-08CR by Onsemi

The Onsemi P3PSL450AG-08CR is a clock generator with 60 MHz output frequency, suitable for applications requiring precise timing. Operating voltage range of 1.6V to 2V, low supply current of 6.4mA, and small outline package make it ideal for compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,307 parts In-Stock

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1,307

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Digiode

USA . 596 parts In-Stock

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596

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TANS Electronics

Latvia . 7,720 parts In-Stock

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7,720

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Kulean Microsystems

USA . 7,234 parts In-Stock

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7,234

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Problanco Electronics

Mexico . 3,321 parts In-Stock

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3,321

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SupplyDigital Components

Austria . 1,389 parts In-Stock

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1,389

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UHIMA Technologies

Türkiye . 489 parts In-Stock

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489

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Corphita

USA . 380 parts In-Stock

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380

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Corohmni

South Africa . 335 parts In-Stock

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Overview

Elevate your electronics with the P3PSL450AG-08CR by Onsemi, a top-tier clock generator that promises superior performance and reliability. With its cutting-edge technology and precision engineering, Onsemi has crafted a product that is perfect for a wide range of applications. From ensuring seamless synchronization in communication systems to enhancing data processing speeds in computing devices, this clock generator delivers unparalleled value and benefits to customers. Trust Onsemi to provide you with the quality and innovation you need to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that is commonly used in electronic devices, making this clock generator easy to handle and resistant to damage.

Surface Mount: YES

Easy to integrate into circuit boards without the need for additional mounting hardware, saving space and simplifying assembly.

Maximum Supply Voltage: 2 V

Can operate under a range of supply voltages, providing flexibility in power source options.

Package Shape: SQUARE

Compact design that helps optimize space on the circuit board and facilitates efficient layout.

Maximum Output Clock Frequency: 60 MHz

Capable of delivering high-frequency clock signals, suitable for a wide range of applications requiring precise timing.

Power Supplies (V): 1.8

Operates at a common voltage level, ensuring compatibility with many standard power sources.

No. of Terminals: 8

Provides multiple connection points for interfacing with other components, allowing for versatile integration within electronic systems.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Streamlined package design that minimizes footprint on the circuit board, enabling space-efficient placement in compact electronic devices.

Minimum Supply Voltage: 1.6 V

Can operate at low voltages, conserving power and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

High temperature tolerance that ensures reliable performance even in demanding thermal environments.

Minimum Operating Temperature: -20 °C

Wide operating temperature range suitable for various operating conditions, from cold environments to industrial settings.

Terminal Position: DUAL

Dual terminals for each connection point provide redundancy and improve signal integrity, enhancing overall reliability.

Maximum Seated Height: 0.8 mm

Low-profile design that helps maintain a slim form factor in electronic devices with limited vertical space.

Width: 2 mm

Compact width dimension that contributes to the overall small footprint of the clock generator on the circuit board.

Length: 2 mm

Compact length dimension that aids in optimizing the layout and placement of the clock generator within the electronic system.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Specialized IC designed specifically for generating clock signals, ensuring precise timing and synchronization in digital circuits.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: NO LEAD

Lead-free terminal form that complies with environmental regulations and minimizes the risk of hazardous materials in electronic products.

Maximum Supply Current: 6.4 mA

Low power consumption requirement that helps conserve energy and reduce operating costs in electronic devices.

Nominal Supply Voltage: 1.8 V

Stable supply voltage that ensures consistent performance and reliable operation of the clock generator over time.

Terminal Pitch: 0.5 mm

Fine pitch spacing between terminals that facilitates precise soldering and connection to the circuit board, enhancing electrical reliability.

Nominal Primary Clock/Crystal Frequency: 60 MHz

Standard clock frequency that meets the timing requirements of most digital applications, making this clock generator suitable for a wide range of devices.

Technical Specifications

Clock Generators P3PSL450AG-08CR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

S-PDSO-N8

Length:

2 mm

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Clock Frequency:

60 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8

Nominal Primary Clock/Crystal Frequency:

60 MHz

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

6.4 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.6 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Peripheral IC Type:

Trade Compliance

P3PSL450AG-08CR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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