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NLVVHC1GT14DTT1

Onsemi

NLVVHC1GT14DTT1 by Onsemi

NLVVHC1GT14DTT1 by Onsemi is a logic IC with inverter & Schmitt Trigger. It comes in Tape & Reel package, SC-70-5/SOT-353. Ideal for Universal Bus Functions, it has MSL of 3 and standard package of 3,000 units.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

NLVVHC1GT14DTT1 by Onsemi
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,763 parts In-Stock

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Digiode

USA . 2,065 parts In-Stock

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2,065

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Distributors (Availability)

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AZTECH Wire

Italy . 785 parts In-Stock

1+ parts

$13.350

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785

$13.350

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TANS Electronics

Latvia . 8,280 parts In-Stock

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8,280

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SupplyDigital Components

Austria . 5,908 parts In-Stock

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5,908

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Kulean Microsystems

USA . 2,597 parts In-Stock

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2,597

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Problanco Electronics

Mexico . 2,275 parts In-Stock

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2,275

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Corphita

USA . 907 parts In-Stock

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907

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UHIMA Technologies

Türkiye . 409 parts In-Stock

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409

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Corohmni

South Africa . 322 parts In-Stock

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322

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Microchip USA

USA . 321 parts In-Stock

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321

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Overview

Elevate your projects with the NLVVHC1GT14DTT1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product they create. This versatile integrated circuit is perfect for a range of applications, offering universal bus functions and logic type inverter with Schmitt trigger. With a standard package of 3,000, this product ensures you have everything you need to bring your ideas to life. Trust in Onsemi to provide you with the value, benefits, and advantages you deserve in your electronic components.

Feature Benefit Bullets

Standard Package: 3,000

Buying in bulk quantities can help reduce the overall cost per unit, making it a cost-effective choice for large-scale projects.

Category: Integrated Circuits (ICs) Logic

As part of the logic category, this product is essential for performing various digital operations, making it a versatile and valuable component.

Package: Tape & Reel (TR)

The Tape & Reel packaging provides automated handling during assembly processes, ensuring efficiency and convenience.

Logic Type: Inverter with Schmitt Trigger

The inclusion of a Schmitt Trigger allows for hysteresis and noise immunity, enhancing the reliability and stability of the logic operation.

Mounting Type: Surface Mount

Surface mount components save space on PCBs and offer improved mechanical and thermal performance, making them suitable for compact and high-density designs.

Package / Case: 5-TSSOP, SC-70-5, SOT-353

The variety of package options allows for flexibility in board layout design and compatibility with different assembly processes.

Supplier Device Package: SC-88A (SC-70-5/SOT-353)

The SC-88A package offers a small form factor while maintaining thermal performance, making it suitable for compact electronic devices with limited space.

Base Product Number: NLVVHC1

The specific product number helps in easy identification and selection of the correct component for the intended application.

Moisture Sensitivity Level (MSL): 3 (168 Hours)

The MSL 3 rating indicates the level of protection against moisture, ensuring proper handling and storage to maintain the component's reliability and performance.

Technical Specifications

Additional Parts NLVVHC1GT14DTT1 attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Category:

Integrated Circuits (ICs)
Logic Universal Bus Functions

Package / Case:

5-TSSOP, SC-70-5, SOT-353

Logic Type:

Inverter with Schmitt Trigger

Package:

Tape & Reel (TR)

Number of Circuits:

1

Mounting Type:

Surface Mount

Supplier Device Package:

SC-88A (SC-70-5/SOT-353)

Standard Package:

3,000

Base Product Number:

NLVVHC1

Moisture Sensitivity Level (MSL):

3 (168 Hours)

Trade Compliance

NLVVHC1GT14DTT1 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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